LED照明用基板材料「ECOOL」系列

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本材料是为了针对客户多样的散热用途,提供适用的解决方案中所用的基板材料。
实现树脂基板才拥有的易加工和易设计性,以及优异的性价比。
本产品阵容中包括单面/双面板型、挠性型、多层型和薄板型的产品。

Circuit board material thermal characteristics

Circuit board material thermal characteristics

General properties

Item Unit ECOOL
     R-1586(H)     
        ECOOL        
R-1787
Our conventional
FR-4

R-1705
UL/ANSI grade CEM-3 CEM-3 FR-4.0
Dielectric layer thickness mm 1.0 1.0 1.0
Thermal conductivity*1 W/m・K 1.5 1.1 0.4
Thermal resistance ℃/W 5.0 6.7 17.5

Condition : As received
*1 Laser flash method

The above data are typical values and not guaranteed values.