Electronic Materials Business Division, Panasonic Industry Co., Ltd. would like to revise the price of Copper Clad Laminate, Prepreg, Glass Composite Circuit Board Materials and Flexible Circuit Board Materials.
Raw material prices continue to rise, while energy and logistics costs remain at a high level.
In addition, we have made every effort to maintain product quality and ensure a stable supply, which we regard as our highest priorities.
Therefore, in order to ensure the stable continuation of our business and stable supply, we have decided to revise our product as follows;
■Product and Price Revision Range
1. Glass epoxy multi-layer circuit board materials
| Copper Clad Laminate | +30% |
|---|---|
| Prepreg | +20% |
2. Low transmission loss Multi-layer Circuit board materials(MEGTRON/XPEDION)
| Copper Clad Laminate | +20% |
|---|---|
| Prepreg | +15% |
3. Glass composite circuit board materials(CEM-3)
| CEM-3 | +30% |
|---|
4. Flexible circuit board materials(FCCL)
| FCCL | +15% |
|---|
■Effective date
From May 1, 2026 (Ex-Factory basis)