- Cures at a low temp of 80℃.
After curing, Tg is 140℃ or greater.
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Achieving the necessary mount reliability
for automotive parts - Smaller difference in heat shrinkage
with other part, by high Tg
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Improving electrical connection reliability
of solder etc. - Capillary flow in the narrow gap
without any voids
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Possible to capillary flow up to 40 mm
in the gap of 20μm
Feature (Solution for Customers)
1. Passes temperature cycling test needed for automotive parts.
- New product
- Maintains low thermal expansion area due to high Tg.
Reduces stress by low elasticity and prevents interfacial peeling. - Conventional
- It is difficult for the material with high linear expansion to reduce the stress of parts, peeling off during temperature cycling.
The low temperature curing / low Tg material has a problem with temperature cycling.
2. Compatible with sensors requiring low temperature curing.
- New product
- Cures at a low temperature.
- Conventional
- Can not be mounted on a sensor that is sensitive to high temperature.
3. A wide range of curing temperature.
- New product
- Can be used at various temperatures.
- Conventional
- It is necessary to use the underfill material defferently
at low temperature and high temperature.
4. Suitable for mounting in areas with small gaps.
- New product
- Corresponds to a gap of 20 μm or more with one kind material.
- Conventional
- It is necessary to use the underfill material defferently
- depending on the size of the gap
between the package and the motherboard.
5. Possible to reinforce partially.
- New product
- We also have "Corner reinforce type" suitable for only a part.
- ※Conventional: Our material CV5313
- ●We have various other line-up. Please contact us.
Property data
| Item | Unit | CV5350AS |
|---|---|---|
| Minimum flow gap | μm | 20 |
| Viscosity (25°C) | mPa·s | 4000 |
| Glass transition temperature (Tg) | °C | 150 |
| C.T.E.1 | ppm/°C | 30 |
| Elastic modulus (25°C) | GPa | 10 |
| Potential for reworking | ‐ | Not possible |
Application
Mount reinforcement of
semiconductor packages and electronic parts for
- Automotive camera modules
- Communication modules (millimeter-wave radar modules)
- ECU (electronic control unit)
Press Release
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