移动设备用 高流动性LCP树脂成型材料

请事先务必阅读注意事项
放大
实现高焊接强度。
最适于极小精密零件的成型。(薄壁成型)
具有支持窄口的高流动性和高耐热性。

Plastic Molding Compound

  • MBL540V
  • MBL240V

Use

For mobile products
Connector, Electronic components

Achieving high fluidity and heat resistance at narrow gate

Achieving high fluidity and heat resistance at narrow gate

Measurement of (maximum) tensile strength of portion having weld line

Measurement of (maximum) tensile strength of portion having weld line

Warpage reduction comparison

Warpage reduction comparison

General properties

Evaluation using test piece having connector shape For narrow-pitch connector Wide use connector
MBL540V MBL240V Our prototype
Weld strength High strength Conventional LCP
Bending strength Molding compound A N 22 23 18
Amount of bending deflection Molding compound A mm 0.80 0.75 0.43
Flexural modulus Molding compound A GPa 15 18 20
Tensile strength of the welding part Molding compound A N 36 34 17
Warpage Molding compound B mm 0.068 0.071 0.130
Warpage
(After 270°C reflow×3times)
Molding compound B mm 0.075 0.082 0.143
Fluidity(Injection flow) Molding compound B mm 52 55 45

The above data is actual values and not guaranteed values.

Related information