Presentation of Georgia Institute of Technology(Panasonic supplies materials)
Fabrication and Reliability Demonstration of 5 µm Redistribution Layer Using Low-Stress Dielectric Dry Film
- Pratik Nimbalkar - Georgia Institute of Technology
- Fuhan Liu - Georgia Institute of Technology
- Mohan Kathaperumal - Georgia Institute of Technology
- Cheng Ping Lin - Panasonic Corporation
- Fukuya Naohito - Panasonic Corporation
- Toshiyuki Makita - Panasonic Corporation
- Naoki Watanabe - Panasonic Industrial Devices Sales Company of America
- Atsushi Kubo - Tokyo Ohka Kogyo Co. Ltd.
- Madhavan Swaminathan - Georgia Institute of Technology
- Rao Tummala - Georgia Institute of Technology
Panasonic has developed a novel low-stress dielectric film (PLSF) for semiconductor packaging.
Polymers films with low stress are of importance to warpage control which is one of the key factors to fabricate Multi-chip Modules (MCMs) with
large body size.
A process flow for the demonstration of 5/5 μm L/S RDL fabrication was developed in addition to demonstration of 7 μm microvia fabrication
using the Panasonic film.
This presentation will also include Warpage and residual stress of the PLSF characterization at various stages of fabrication along with
preliminary results of TCT.
Design and Demonstration of Single and Coupled Embedded Toroidal Inductors for 48V to 1V Integrated Voltage Regulators
- Claudio Alvarez - Georgia Institute of Technology
- Srinidhi Suresh - Georgia Institute of Technology
- Madhavan Swaminathan - Georgia Institute of Technology
- Rao Tummala - Georgia Institute of Technology
- Daisuke Sasaki - Panasonic Corporation
- Kazuki Watanabe - Panasonic Corporation
- Ryo Nagatsuka - Panasonic Corporation
- Cheng Ping Lin - Panasonic Corporation
- Naoki Watanabe - Panasonic Industrial Devices Sales Company of America
Panasonic has developed a high permeability magnetic material for high-density embedded inductors for Integrated Voltage Regulators.
Novel embedded toroidal inductors were fabricated using Panasonic’s magnetic sheet along with process feasibility and measurements,
which are covered in the presentation.
Panasonic Encapsulation & Substrate Materials for Semiconductor
