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Flexible Circuit Board Materials for Mobile Products "FELIOS" series
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R-F775_14RN_9-25-9(RA)
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Thermosetting stretchable film BEYOLEX
Ultra-light EMC shielding material
R-F775_14RN_9-25-9(RA) : Flexible Circuit Board Materials for Mobile Products "FELIOS" series
Product
Flexible Circuit Board Materials for Mobile Products "FELIOS" series
Series/Type
R-F775 (Double-sided copper clad)
Parts no
R-F775_14RN_9-25-9(RA)
Zoom
Datasheet
Notes for using technical information.
스펙
Item
Performance characteristics
Glass transition temp.(Tg) :TMA(Ad) (°C)
-
Glass transition temp.(Tg) :DMA
Measurement in tensile mode(Ad) (°C)
-
CTE:α1,X-axis,IPC-TM-650 2.4.24 (ppm/°C)
-
CTE:α1,Y-axis,IPC-TM-650 2.4.24 (ppm/°C)
-
CTE:α1,Z-axis,IPC-TM-650 2.4.24 (ppm/°C)
-
CTE:α2,Z-axis,IPC-TM-650 2.4.24 (ppm/°C)
-
Volume resistivity:IPC-TM-650 2.5.17.1,C-96/35/90 (MΩ·cm)
-
Dielectric constant(Dk)@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 (Ad)
-
Dissipation factor(Df )@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 (Ad)
-
Water absorption:IPC-TM-650 2.6.2.1,D-24/23 (%)
-
Peel strength,1oz:IPC-TM-650 2.4.8 (kN/m (lb/inch))
-
Flammability:UL,A+E-168/70
-
The sample thickness
-
*1 Condition: C-96/20/65, Unit : MΩ·m
-
*2 Condition: E-24/50+D-24/23
-
*3 Measured by R-FR10/R-F775 25μm/ R-FR10 construction
-
Copper Foil Type
RA
Copper Foil Part No.
BHY-HA-V2
Copper Foil Thickness (µm)
9
Fiim Thickness (µm)
25
Total products thickness (µm)
43
Peel Strength.90°:JIS C 6471.A (mm)
1.3
Peel Strength.90°:JIS C 6471.260℃ Solder 5sec (mm)
1.3
Dimensional Stability.MD:IPC-TM-650.After Etching (%)
0.025
Dimensional Stability.TD:IPC-TM-650.After Etching (%)
0.025
Dimensional Stability.MD:IPC-TM-650.E-0.5/150 (%)
-0.004
Dimensional Stability.TD:IPC-TM-650.E-0.5/150 (%)
-0.011
Soldering Resistance:JIS C 6471.A (°C)
330
Soldering Resistance:JIS C 6471.C-96/40/90 (°C)
260
MIT Test:JIS C 6471.0.38R×4.9N,MD
340
MIT Test:JIS C 6471.0.38R×4.9N,TD
340
Tensile Modulus:IPC-TM-650 (GPa)
7.1
Coefficient of Thermal Expansion.MD:TMA 100℃→250℃,
5℃/min (ppm/K)
19.3
Coefficient of Thermal Expansion.TD:TMA 100℃→250℃,
5℃/min (ppm/K)
17.3
Dielectric Constant at 1MHz:IPC-TM-650 2.5.5.5.A
3.2
Dielectric Constant at 2GHz:IPC-TM-650 2.5.5.5.A
3.2
Dielectric Constant at 10GHz:Cavity resonance.A
-
Dissipation Factor at 1MHz:IPC-TM-650 2.5.5.5.A
0.002
Dissipation Factor at 2GHz:IPC-TM-650 2.5.5.5.A
0.002
Dissipation Factor at 10GHz:Cavity resonance.A
-
Insulation resistance:JIS C 6471.A (Ω)
>1.0×10^14
Insulation resistance:JIS C 6471.C-96/40/90 (Ω)
>1.0×10^14
Water absorption.IPC-TM-650:JIS C 6471.D-24/23 (%)
0.8
Water absorption:JIS C 6471.D-24/23 (%)
-
Moisture Absorption.IPC-TM-650:C-24/23/50 (%)
0.7
Tg:DMA.A (°C)
350
Flammability:UL 94.A+E-168/70
V-0
* These are observed data, not guaranteed performance.
The test method of above item is determined according to Panasonic internal standard.
-
닫힘
Documents
[Catalog/Datasheet]
Catalog_FELIOS_R-F775_en(120KB)
DataSheet__FELIOS_R-F775_JIS_en(50KB)
[Technical Information]
outgas_datasheet_en(136KB)
닫힘