Molded Underfill(MUF) Semiconductor encapsulation Molding compounds | CV8581, CV8713

Molded Underfill(MUF) Semiconductor encapsulation Molding compounds

 

  1. MUF materials realize underfilling to the narrow gap under flip-chip without void and overmolding the die at the same mold shot
  2. Provide a better solution based on high loading technology of fine filler and resin design technology

Semiconductor Encapsulation Materials

  •  Part Number 

CV8581 CV8713

  • Application
  • Detailed use
PKG
Mobile
・PKG
・Mobile
Advanced IC Packages(Flip-chip package such as FC-CSP, FC-SiP module, etc.)

Features

Saving process time
Excellent fillability
for Narrow gap/pitch
Low warpage

EMC (Epoxy Molding Compound) explainer video

Process comparison

Process comparison

Excellent fillability for Narrow gap and pitch

Excellent fillability for Narrow gap and pitch

Application

Application

General properties

Item Unit LEXCM CF
CV8581MUW CV8713UB CV8714AHSL X8770UY
Tg (TMA) °C 170 145 153 150
CTE 1 ppm/°C 20 9 12 9
CTE 2 64 38 47 40
Flexural modulus (25°C) GPa 16 24 23 26
Filler size (Max) µm 20 20 10 20
Mold shrinkage 0.32 0.20 0.21 0.20

The above data are typical values and not guaranteed values.

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