放大
本材料是可满足智能手机、数码家电等移动设备的多种装配需求的挠性基板材料。
本产品阵容中包括具有优异尺寸稳定性、回弹性和高频特性等特性的产品。
Circuit Board Materials
FELIOS series of excellent dimensional stability
Suggestion in each part of a smartphone
Layer composition of rigid-flex board and suggestion of materials
