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- Due to our industry leading low dielectric constant and dissipation factor, these materials are suitable for high-speed data transmission by servers and routers using high-layercount, large-size PCB designs.
Circuit Board Materials
- Part Number
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- Application
- Detailed use
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・Network
・Wireless
・Aerospace
・Wireless
・Aerospace
ICT infrastructure equipment, Supercomputer, Measuring instrument, Antenna(Base station, Automotive millimeter-wave radar), Aerospace, etc.
New part number
Low Dk glass cloth
Laminate R-578Y(N)
Prepreg R-568Y(N)
Low Dk glass cloth
Improved processability
Laminate R-578Y(GN)
Prepreg R-568Y(GN)
Normal glass cloth
Improved processability
Laminate R-578Y(GE)
Prepreg R-568Y(GE)
Buried Resistor Copper Foil
Laminate R-578Y(R)
Existing part number
Low Dk glass cloth
Laminate R-5785(N)
Prepreg R-5680(N)
Low Dk glass cloth
Improved processability
Laminate R-5785(GN)
Prepreg R-5680(GN)
Normal glass cloth
Improved processability
Laminate R-5785(GE)
Prepreg R-5680(GE)
Buried Resistor Copper Foil
Laminate R-5785(R)
- There might be some differences in UL certification conditions between the existing part numbers and the new part numbers. Please contact a sales representative in charge or this form for the detail.
Any letters with parentheses ( ) at the end of a part number are for identification code in our company and are not included in the part numbers registered for UL certification.
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Properties
Dk 3.31 Df 0.0023
@14GHz
@14GHz
Tg(DSC)
200°C
200°C
T288(with copper)
>120min
>120min
Video
Transmission loss performance Ranking in MEGTRON series
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Frequency dependence by Transmission loss
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Heat resistance of High Multi-layered
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Buried Resistor Copper Foil specification
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General properties
Item | Test method | Condition | Unit | MEGTRON7 R-578Y(N) R-5785(N) Low Dk glass cloth |
MEGTRON7 R-578Y(GN) R-5785(GN) Low Dk glass cloth |
MEGTRON7 R-578Y(GE) R-5785(GE) Normal glass cloth |
|
---|---|---|---|---|---|---|---|
Glass transition temp.(Tg) | DSC | A | °C | 200 | 200 | 200 | |
CTE z-axis | α1 | IPC-TM-650 2.4.24 |
A | ppm/°C | 42 | 42 | 42 |
α2 | 280 | 280 | 280 | ||||
T288(with copper) | IPC-TM-650 2.4.24.1 |
A | 分 | >120 | >120 | >120 | |
Dielectric constant(Dk) | 13GHz 14GHz |
Balanced-type circular disk resonator |
C-24/23/50 | - | 3.31 [14GHz] | 3.31 [14GHz] | 3.60 [13GHz] |
Dissipation factor(Df) | 0.0023 [14GHz] | 0.0023 [14GHz] | 0.0034 [13GHz] | ||||
Peel strength* | 1oz(35μm) | IPC-TM-650 2.4.8 |
A | kN/m | 0.8 | 0.8 | 0.8 |
The sample thickness is 0.75mm.
* R-578Y(GN), R-5785(GN), R-578Y(GE), R-5785(GE): H-VLP2 Copper, R-578Y(N), R-5785(N): H-VLP Copper
The above data are typical values and not guaranteed values.