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What's New

2024

Feb 7, 2024
Temporary Suspension of Certifications of International Standard for Quality Management Systems, IATF 16949
Feb 2, 2024
Temporary Suspension of Certifications of International Standard for Quality Management Systems, ISO 9001
Jan 12, 2024
Irregularities in third-party certification of electronic materials and establishment of the external investigation committee
Jan 11, 2024
在恶劣太空环境下的暴露实验中验证我公司电子材料的耐久性

2023

May 15, 2023
行业首创丨松下最新研发高热传导性多层基板用薄膜“R-2400”

2022

Aug 30, 2022
Price Revision on Semiconductor Encapsulation Materials
Jan 18, 2022
Panasonic Develops MEGTRON 8 Multi-Layer Circuit Board Materials Featuring Low Transmission Loss for High-Speed Communication Networking Equipment

2021

Mar 15, 2024
Part Number List of Irregularities in Third-party Certification
Mar 15, 2024
Identification of irregularities in additional part numbers and an additional factory in third-party certification
Nov 10, 2021
Price Revision on Semiconductor Encapsulation Materials
Aug 6, 2021
Introduction of New Material For Next Generation Display Development
TOUGHTELON
Jun 22, 2021
Panasonic Commercializes a New Semiconductor Substrate Material Designed to Improve Reliability
Mar 2, 2021
Panasonic Commercializes Temperature-Resistant Sidefill for Surface Mount Assembly Reinforcement
Feb 25, 2021
Panasonic Commercializes R-5410 Halogen-free Ultra-low Transmission Loss Multi-Layer Circuit Board Material for Millimeter-Wave Antennas

2020

May 19, 2020
Exhibition information: ECTC 2020 Virtual Conference
Jan 7, 2020
Revocation of our exhibition to “12th AUTOMOTIVE WORLD 2020”

2019

Jan 21, 2019
Panasonic Commercializes Halogen-free Multi-layer Circuit Board Material (Halogen-free MEGTRON6) for Communications Infrastructure Equipment

2018

Dec 21, 2018
Exhibition infomation : AUTOMOTIVE WORLD Tokyo 2019
Dec 13, 2018
To Bolster Substrate Material Business in North East Asian Region
Sep 3, 2018
Panasonic Commercializes Heat Resistant Underfill CV5794 Designed to Improve the Reliability of Automotive Electronics
Aug 29, 2018
Panasonic Commercializes Granular Epoxy Mold Compound (EMC) Semiconductor Encapsulation Materials for FOWLP and PLP
Jun 4, 2018
Panasonic Develops Glass Composite Circuit Board Material that Improves Parts Mounting Reliability
May 29, 2018
Panasonic Develops an Ultra-low Transmission Loss Circuit Board Material for Semiconductor Packages and Modules
Mar 9, 2018
Panasonic Announces Price Revisions for Copper Clad Laminates, Prepregs, and Mass Laminations
Feb 8, 2018
Panasonic Launches Production of Molded Underfill Semiconductor Encapsulation Materials in Shanghai
Jan 11, 2018
Panasonic Develops "Halogen-free Ultra-low Transmission Loss Circuit Board Material" for Millimeter-wave Band Antennas

2017

Jun 1, 2017
Panasonic Commercializes "High Thermal Conductivity, Low Transmission Loss Halogen-free Multi-layer Circuit Board Material" for Wireless Base Stations
May 12, 2017
Panasonic Announces Price Revisions for Copper Clad Laminates, Prepregs, and Mass Laminations
Feb 3, 2017
Panasonic Develops Low-temperature Curing Secondary Mounting Underfill Material that Improves Mounting Reliability of Automotive Parts
Jan 17, 2017
Panasonic Commercializes Low Transmission Loss Flexible Multi-layer Circuit Board Materials

2016

Dec 27, 2016
Price Revision for Copper clad Laminates and Mass Laminations
Dec 22, 2016
Panasonic Commercializes High Heat Resistance Halogen-free Multi-layer Circuit Board Material for Automotive Use
Aug 25, 2016
Panasonic Commercializes "Time-lagged UV Curing Adhesive" Suitable for Assembly of Mobile Phone Housings and UV-Protection Panels
May 30, 2016
Panasonic Commercializes a Substrate Material for Semiconductor Packages Featuring Reduced Internal Stress that Leads to Lower Warpage
May 26, 2016
Panasonic Commercializes "Sheet-Form Encapsulation Material for Coreless Package Substrates"
Apr 5, 2016
Panasonic Develops Light Diffusion Polypropylene Resin Molding Compounds "FULL BRIGHT" PP
Mar 18, 2016
Panasonic Commercializes a High Dielectric Constant Encapsulation Molding Compound Suitable for Finger-Print Sensor Packages
Mar 3, 2016
Panasonic Commercializes the Industry's First Sulfur-free Encapsulation Molding Compound for Copper Wires

2012

Aug 6, 2021
Introduction of New Material For Next Generation Display Development
TOUGHTELON
February 27, 2012
PDFAnnouncing the release of the thermosetting plastic molding-materials “Full Bright” used for LED reflectors

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