Electronic Materials Top Page

2025

September 12, 2025

多层基板材料“MEGTRON”的产能5年提高2倍

April 21, 2025

MEGTRON7 Qualified for PCB at European Space Agency ESA

February 3, 2025

Partial Withdrawal Third-Party Certification for Electronic Materials

January 29, 2025

Price Revision of Flexible Circuit Board Materials

2024

November 1, 2024

Investigation Results on Quality Irregularities by the External Investigation Committee and Endeavors Taken at PID

October 31, 2024

Update of Part Number List of Irregularities in Third-party Certification

September 6, 2024

Update of Part Number List of Irregularities in Third-party Certification

July 25, 2024

Price Revision of Circuit Board Materials

July 1, 2024

Partial withdrawal of third-party certification registration from electronic materials

June 3, 2024

Partial withdrawal of third-party certification registration from electronic materials

May 22, 2024

Update of Part Number List of Irregularities in Third-party Certification

May 20, 2024

Withdrawal of Certifications of International Standard for Quality Management Systems, IATF 16949

Apr 26, 2024

Update of Part Number List of Irregularities in Third-party Certification

Apr 12, 2024

Update of Part Number List of Irregularities in Third-party Certification

Mar 22, 2024

Withdrawal of Certifications of International Standard for Quality Management Systems, ISO 9001

Mar 15, 2024

Part Number List of Irregularities in Third-party Certification

Mar 15, 2024

Identification of irregularities in additional part numbers and an additional factory in third-party certification

Feb 7, 2024

Temporary Suspension of Certifications of International Standard for Quality Management Systems, IATF 16949

Feb 2, 2024

Temporary Suspension of Certifications of International Standard for Quality Management Systems, ISO 9001

Jan 12, 2024

Irregularities in third-party certification of electronic materials and establishment of the external investigation committee

Jan 11, 2024

在恶劣太空环境下的暴露实验中验证我公司电子材料的耐久性

2023

May 15, 2023

行业首创丨松下最新研发高热传导性多层基板用薄膜“R-2400”

2022

Aug 30, 2022

Price Revision on Semiconductor Encapsulation Materials

Jan 18, 2022

Panasonic Develops MEGTRON 8 Multi-Layer Circuit Board Materials Featuring Low Transmission Loss for High-Speed Communication Networking Equipment

2021

Mar 15, 2024

Part Number List of Irregularities in Third-party Certification

Mar 15, 2024

Identification of irregularities in additional part numbers and an additional factory in third-party certification

Nov 10, 2021

Price Revision on Semiconductor Encapsulation Materials

Aug 6, 2021

Introduction of New Material For Next Generation Display Development
TOUGHTELON

Jun 22, 2021

Panasonic Commercializes a New Semiconductor Substrate Material Designed to Improve Reliability

Mar 2, 2021

Panasonic Commercializes Temperature-Resistant Sidefill for Surface Mount Assembly Reinforcement

Feb 25, 2021

Panasonic Commercializes R-5410 Halogen-free Ultra-low Transmission Loss Multi-Layer Circuit Board Material for Millimeter-Wave Antennas

2020

May 19, 2020

Exhibition information: ECTC 2020 Virtual Conference

Jan 7, 2020

Revocation of our exhibition to “12th AUTOMOTIVE WORLD 2020”

2019

Jan 21, 2019

Panasonic Commercializes Halogen-free Multi-layer Circuit Board Material (Halogen-free MEGTRON6) for Communications Infrastructure Equipment

2018

Dec 21, 2018

Exhibition infomation : AUTOMOTIVE WORLD Tokyo 2019

Dec 13, 2018

To Bolster Substrate Material Business in North East Asian Region

Sep 3, 2018

Panasonic Commercializes Heat Resistant Underfill CV5794 Designed to Improve the Reliability of Automotive Electronics

Aug 29, 2018

Panasonic Commercializes Granular Epoxy Mold Compound (EMC) Semiconductor Encapsulation Materials for FOWLP and PLP

Jun 4, 2018

Panasonic Develops Glass Composite Circuit Board Material that Improves Parts Mounting Reliability

May 29, 2018

Panasonic Develops an Ultra-low Transmission Loss Circuit Board Material for Semiconductor Packages and Modules

Mar 9, 2018

Panasonic Announces Price Revisions for Copper Clad Laminates, Prepregs, and Mass Laminations

Feb 8, 2018

Panasonic Launches Production of Molded Underfill Semiconductor Encapsulation Materials in Shanghai

Jan 11, 2018

Panasonic Develops "Halogen-free Ultra-low Transmission Loss Circuit Board Material" for Millimeter-wave Band Antennas

2017

Jun 1, 2017

Panasonic Commercializes "High Thermal Conductivity, Low Transmission Loss Halogen-free Multi-layer Circuit Board Material" for Wireless Base Stations

May 12, 2017

Panasonic Announces Price Revisions for Copper Clad Laminates, Prepregs, and Mass Laminations

Feb 3, 2017

Panasonic Develops Low-temperature Curing Secondary Mounting Underfill Material that Improves Mounting Reliability of Automotive Parts

Jan 17, 2017

Panasonic Commercializes Low Transmission Loss Flexible Multi-layer Circuit Board Materials

2016

Dec 27, 2016

Price Revision for Copper clad Laminates and Mass Laminations

Dec 22, 2016

Panasonic Commercializes High Heat Resistance Halogen-free Multi-layer Circuit Board Material for Automotive Use

Aug 25, 2016

Panasonic Commercializes "Time-lagged UV Curing Adhesive" Suitable for Assembly of Mobile Phone Housings and UV-Protection Panels

May 30, 2016

Panasonic Commercializes a Substrate Material for Semiconductor Packages Featuring Reduced Internal Stress that Leads to Lower Warpage

May 26, 2016

Panasonic Commercializes "Sheet-Form Encapsulation Material for Coreless Package Substrates"

Apr 5, 2016

Panasonic Develops Light Diffusion Polypropylene Resin Molding Compounds "FULL BRIGHT" PP

Mar 18, 2016

Panasonic Commercializes a High Dielectric Constant Encapsulation Molding Compound Suitable for Finger-Print Sensor Packages

Mar 3, 2016

Panasonic Commercializes the Industry's First Sulfur-free Encapsulation Molding Compound for Copper Wires

2012

Aug 6, 2021

Introduction of New Material For Next Generation Display Development
TOUGHTELON

February 27, 2012

Announcing the release of the thermosetting plastic molding-materials “Full Bright” used for LED reflectors