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What's New
2024
- November 1, 2024
- Investigation Results on Quality Irregularities by the External Investigation Committee and Endeavors Taken at PID
- October 31, 2024
- Update of Part Number List of Irregularities in Third-party Certification
- September 6, 2024
- Update of Part Number List of Irregularities in Third-party Certification
- July 25, 2024
- Price Revision of Circuit Board Materials
- July 1, 2024
- Partial withdrawal of third-party certification registration from electronic materials
- June 3, 2024
- Partial withdrawal of third-party certification registration from electronic materials
- May 22, 2024
- Update of Part Number List of Irregularities in Third-party Certification
- May 20, 2024
- Withdrawal of Certifications of International Standard for Quality Management Systems, IATF 16949
- Apr 26, 2024
- Update of Part Number List of Irregularities in Third-party Certification
- Apr 12, 2024
- Update of Part Number List of Irregularities in Third-party Certification
- Mar 22, 2024
- Withdrawal of Certifications of International Standard for Quality Management Systems, ISO 9001
- Mar 15, 2024
- Part Number List of Irregularities in Third-party Certification
- Mar 15, 2024
- Identification of irregularities in additional part numbers and an additional factory in third-party certification
- Feb 7, 2024
- Temporary Suspension of Certifications of International Standard for Quality Management Systems, IATF 16949
- Feb 2, 2024
- Temporary Suspension of Certifications of International Standard for Quality Management Systems, ISO 9001
- Jan 12, 2024
- Irregularities in third-party certification of electronic materials and establishment of the external investigation committee
- Jan 11, 2024
- 在恶劣太空环境下的暴露实验中验证我公司电子材料的耐久性
2023
- May 15, 2023
- 行业首创丨松下最新研发高热传导性多层基板用薄膜“R-2400”
2022
- Aug 30, 2022
- Price Revision on Semiconductor Encapsulation Materials
- Jan 18, 2022
- Panasonic Develops MEGTRON 8 Multi-Layer Circuit Board Materials Featuring Low Transmission Loss for High-Speed Communication Networking Equipment
2021
- Mar 15, 2024
- Part Number List of Irregularities in Third-party Certification
- Mar 15, 2024
- Identification of irregularities in additional part numbers and an additional factory in third-party certification
- Nov 10, 2021
- Price Revision on Semiconductor Encapsulation Materials
- Aug 6, 2021
- Introduction of New Material For Next Generation Display Development
TOUGHTELON - Jun 22, 2021
- Panasonic Commercializes a New Semiconductor Substrate Material Designed to Improve Reliability
- Mar 2, 2021
- Panasonic Commercializes Temperature-Resistant Sidefill for Surface Mount Assembly Reinforcement
- Feb 25, 2021
- Panasonic Commercializes R-5410 Halogen-free Ultra-low Transmission Loss Multi-Layer Circuit Board Material for Millimeter-Wave Antennas
2020
- May 19, 2020
- Exhibition information: ECTC 2020 Virtual Conference
- Jan 7, 2020
- Revocation of our exhibition to “12th AUTOMOTIVE WORLD 2020”
2019
2018
- Dec 21, 2018
- Exhibition infomation : AUTOMOTIVE WORLD Tokyo 2019
- Dec 13, 2018
- To Bolster Substrate Material Business in North East Asian Region
- Sep 3, 2018
- Panasonic Commercializes Heat Resistant Underfill CV5794 Designed to Improve the Reliability of Automotive Electronics
- Aug 29, 2018
- Panasonic Commercializes Granular Epoxy Mold Compound (EMC) Semiconductor Encapsulation Materials for FOWLP and PLP
- Jun 4, 2018
- Panasonic Develops Glass Composite Circuit Board Material that Improves Parts Mounting Reliability
- May 29, 2018
- Panasonic Develops an Ultra-low Transmission Loss Circuit Board Material for Semiconductor Packages and Modules
- Mar 9, 2018
- Panasonic Announces Price Revisions for Copper Clad Laminates, Prepregs, and Mass Laminations
- Feb 8, 2018
- Panasonic Launches Production of Molded Underfill Semiconductor Encapsulation Materials in Shanghai
- Jan 11, 2018
- Panasonic Develops "Halogen-free Ultra-low Transmission Loss Circuit Board Material" for Millimeter-wave Band Antennas
2017
- Jun 1, 2017
- Panasonic Commercializes "High Thermal Conductivity, Low Transmission Loss Halogen-free Multi-layer Circuit Board Material" for Wireless Base Stations
- May 12, 2017
- Panasonic Announces Price Revisions for Copper Clad Laminates, Prepregs, and Mass Laminations
- Feb 3, 2017
- Panasonic Develops Low-temperature Curing Secondary Mounting Underfill Material that Improves Mounting Reliability of Automotive Parts
- Jan 17, 2017
- Panasonic Commercializes Low Transmission Loss Flexible Multi-layer Circuit Board Materials
2016
- Dec 27, 2016
- Price Revision for Copper clad Laminates and Mass Laminations
- Dec 22, 2016
- Panasonic Commercializes High Heat Resistance Halogen-free Multi-layer Circuit Board Material for Automotive Use
- Aug 25, 2016
- Panasonic Commercializes "Time-lagged UV Curing Adhesive" Suitable for Assembly of Mobile Phone Housings and UV-Protection Panels
- May 30, 2016
- Panasonic Commercializes a Substrate Material for Semiconductor Packages Featuring Reduced Internal Stress that Leads to Lower Warpage
- May 26, 2016
- Panasonic Commercializes "Sheet-Form Encapsulation Material for Coreless Package Substrates"
- Apr 5, 2016
- Panasonic Develops Light Diffusion Polypropylene Resin Molding Compounds "FULL BRIGHT" PP
- Mar 18, 2016
- Panasonic Commercializes a High Dielectric Constant Encapsulation Molding Compound Suitable for Finger-Print Sensor Packages
- Mar 3, 2016
- Panasonic Commercializes the Industry's First Sulfur-free Encapsulation Molding Compound for Copper Wires
2012
