About us

Company profile

April 2022

Company Name	Panasonic Industry Co., Ltd. Electronic Materials Business Division
Director	Hideyuki Hounoki
Address	1006,Kadoma,Osaka 571-8506,Japan (Google Map)
Business Policy	Mission Providing material solutions to a changing world, to create a positive future and improve lives. Vision Creating value and contributing to society through innovative materials. Slogan Partnering to go beyond.
Products	Circuit Board Materials Flexible Circuit Board Materials Semiconductor Encapsulation Materials Plastic Molding Compound Advanced Films

Vision movie

History

1918-1929	Business foundation (The origin of the molding materials is the Attachment Plug produced by molding technology called “Nerimono” upon the establishment of Matsushita.Plastic business development period)
1930-1945	Plastic business development (Production of molding materials commenced for thermosetting resins such as phenolic resin.)
1946-1959	Business base establishment
1960-1970	Plastic business establishment Production of laminates, etc. started 1961.Yokkaichi Plant begins operations 1970.Koriyama Plant begins operations
1971-1986	Electronics materials rollout Expanded the business of circuit board materials
1987-1999	1987.South Yokkaichi Plant begins operations 1987.Multi-layer Materials Plant in Taiwan begins operations 1987.Matsushita Electric Works Electronic Materials Sales ,Ltd begins operations 1993.Multi-layer Materials Plant in U.S begins operations 1994.Molding compounds & Encapsulation materials for semiconductors Plant in Ayuthaya, Thailand begins operations 1995.Paper CCL & PCB Plant in Suzhou, China begins operations (Paper CCL production ended in 2011) 1996.Launched “MEGTRON” brand 1996.Paper CCL Plant in Ayutthaya, Thailand begins operations 1999.Multi-layer Materials Plant in Guangzhou,China begins operations
2000	2000.Establishes Panasonic Electric Works Electronic Materials Europe GmbH 2001.Koriyama West Plant begins operations 2002.Molding compounds Plant in Shanghai, China begins operations 2005.Encapsulation materials for semiconductors Plant in Shanghai, China begins operations 2005.Establishes Koriyama MEW, Establishes Yokkaichi MEW      (Merger with Panasonic Corporation in 2017) 2005.Advanced films Plant in Koriyama begins operations 2005.Multi-layer Materials production ended in U.S 2006.Multi-layer Materials Plant in Suzhou, China begins operations 2011.Glass composite Materials Plant in Suzhou, China begins operations 2013.Establishes Electronic Materials China R&D center 2019.Establishes Taiwan Semiconductor Materials R&D center 2021.Launched “LEXCM” brand 2022.Launched “XPEDION” brand 2022.Establishes Panasonic Industry Co., Ltd.