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电容器
- 导电性聚合物铝电解电容器(SP-Cap)
- 导电性聚合物钽固体电解电容器(POSCAP)
- 导电性聚合物铝固体电解电容器(OS-CON)
- 导电性聚合物混合铝电解电容器
- 铝电解电容器(表面贴装型)
- 薄膜电容器(电子机器用)
电阻
电感器
热对策产品
EMC对策产品
电路保护产品
传感器
输入元件
继电器
连接器
电池(法人用)
电子材料
- Ultra-low transmission loss, highly heat-resistant multi-layer circuit board materials MEGTRON8
- Ultra-low transmission loss Highly heat resistant Multi-layer circuit board materials MEGTRON7
- Halogen-free Ultra-low transmission loss Multi-layer circuit board materials, Halogen-free MEGTRON6
- Ultra-low transmission loss Highly heat resistant Multi-layer circuit board materials MEGTRON6
- Highly heat resistant Low CTE Multi-layer circuit board materials <High-Tg type> HIPER V
- Halogen-free Ultra-low transmission loss Multi-layer Circuit board materials XPEDION1
- High thermal conductivity Low transmission loss Halogen-free Multi-layer circuit board materials XPEDION T1
- High thermal conductivity Glass composite circuit board materials ECOOL
- 移动设备用 柔性基板材料「FELIOS」系列
- Flexible circuit board materials FELIOS
- Flexible circuit board materials LCP(Liquid Crystal Polymer) FELIOS LCP
- Halogen-free Multi-layer circuit board materials
- Glass composite circuit board materials
- Liquid Materials for Board level Underfill, Adhesives
- For LED (white reflectors) light reflection/luminous flux thermosetting molding compounds FULL BRIGHT UP
- For LED (optical parts) light diffusion/reflection PP molding compounds FULL BRIGHT PP