- Felios adhesiveless flex materials are available in a wide-range of film and copper foil thicknesses to support all applications.
- Felios offers superior thermal resistance, dimensional stability and quality.
- Suitable for aerospace applications with low outgassing. (Compliant with ASTM E-595)
Circuit Board Materials
- Part Number
Double-sided
copper clad R-F775
Single-sided
copper clad R-F770
- Application
- Detailed use
・Aerospace
・Industry
・Automotive
・Industry
・Automotive
Consumer mobile products (Smartphone, tablet PC), Medical, Industrial, Avionics/Space applications, In-vehicle cable(Wire harness alternative), etc.
Properties
Superior thermal resistance
MOT 160°C
MOT 160°C
Wide line-up of film thickness
and copper foil
and copper foil
Excellent dimensional stability
Dimensional stability
Dimensional change after etching
Panasonic Industry FCCL materials
R-F775 After etching
Panasonic Industry FCCL materials
R-F777 After etching
Comparative material
After etching
Evaluation material is R18-100-R18, thickness 4mil.
The above data are typical values and not guaranteed values
Line-up
General properties
| Item | Test method | Condition | Unit | R-F775 | |
|---|---|---|---|---|---|
| Solder heat resistance | JIS C6471 | A | °C | >330 | |
| C-96/40/90 | 260 | ||||
| Dielectric constant(Dk) | 1GHz | ASTM D150 | A | - | 3.2 |
| Dissipation factor(Df) | 0.003 | ||||
| Tensile Modulus | ASTM D882 | A | GPa | 7.1 | |
| Tensile strength | Internal method | A | MPa | 542 | |
| Peel strength | RA: 1/3oz(12μm) | JIS C6471 | A | N/mm | 1.35 |
| CTE | MD/TD | JIS R3251 | 50-200°C | ppm/°C | 17 / 19 |
| Z-axis | ppm/°C | 101 | |||
| Thermal conductivity | Laser flash | A | W/m･K | 0.16 | |
| Dimensional stability | IPC-TM-650 | After etching MD direction | % | 0.00±0.10 | |
| After etching TD direction | 0.00±0.10 | ||||
| Water absorption | IPC-TM-650 | 23°C 24h immersion | % | 0.9 | |
| Flammability | UL | A + E-168/70 | － | 94V-0 | |
| Outgas | TML / CVCM / WVR* | ASTM E595-07 ASTM E595-15 |
－ | % | 0.62 / 0.05 / 0.55 |
The sample thickness is film 25μm, copper foil 12μm.
* TML: Total Mass Loss
CVCM: Collected Volatile Condensable Material
WVR: Water Vapor Recovered
Our Halogen-free materials are based on JPCA-ES-01-2003 standard and others.
Contain; Chlorine:≤0.09wt%(900ppm), Bromine:≤0.09wt%(900ppm),
Chlorine+Bromine:≤0.15wt%(1500ppm)
The above data are typical values and not guaranteed values.
