放大
本材料是可满足智能手机、数码家电等移动设备的多种装配需求的挠性基板材料。
本产品阵容中包括具有优异尺寸稳定性、回弹性和高频特性等特性的产品。
Circuit Board Materials
FELIOS series of excellent dimensional stability
Suggestion in each part of a smartphone
 | Applications | Requirement | Product Suggestion | |
| ①Antenna, Antenna module | Low-transmission loss | Dk:3.0 Pl:75µm(3mil) Pl:100µm(4mil) Pl:125µm(5mil) Pl:150µm(6mil) |
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| ②LCD module | Impedance control Fine wiring | Cu:2µm, 6µm Dk:3.0 |
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| ③Battery module | High electric current safety | Cu：105µm(3oz) |
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| ④NFC & WPC module | High electric current, Current efficiency | PI：75~150µm Cu：105µm(3oz) |
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Layer composition of rigid-flex board and suggestion of materials
