Flexible circuit board materials LCP(Liquid Crystal Polymer) FELIOS LCP | R-F705S

Flexible circuit board materials LCP(Liquid Crystal Polymer) R-F705S

 

  1. Suitable for high-speed large-volume data transmission of mobile devices
    with good high frequency property
  2. It is suitable for replacement of micro coaxial cable and millimeter-wave radar antenna

Circuit Board Materials

  •  Part Number 

Double-sided R-F705S

Halogen-free
  • Application
  • Detailed use
Mobile
Wireless
・Mobile
・Wireless
Smartphone(Antenna module), Laptop, Tablet PC, 4K/8K display(High-speed FPC cable), Automotive component, Etc.

Properties

Dk 2.9  Df 0.002
@19GHz
Water absorption
0.04%
Peel strength
0.8N/mm

Line-up

Line-up

Concept

Concept

Frequency dependence by Transmission loss

Frequency dependence by Transmission loss

General properties

Item Test method Condition Unit R-F705S
Solder heat resistance JIS C 6471 288°C solder float for 1min No abnormality
Moisture absorption
solder heat resistance
Internal Method C-96/40/90
260°C solder float for 1min
No abnormality
Dielectric constant (Dk) 19GHz Balanced-type
circular disk
resonace
A 2.9
Dissipation factor (Df) 0.002
Dielectric constant (Dk) 10GHz Cavity
resonance
A 3.3
Dissipation factor (Df) 0.002
Tensile modulus ASTM D882 A GPa 3.5
Surface resistivity JIS C 6471 A 4.0×1010
Water absorption Internal Method 25°C 50h immersion % 0.04
Peel strength
ED:18μm
IPC-TM-650
2.4.9
A N/mm 0.8
260℃ solder float for 5sec
Chemical resistance JIS C 6471 HCl 2mol/l 23°C 5min No abnormality
NaOH 2mol/l 23°C 5min
IPA 23°C 5min
Dimensional stability IPC TM-650
2.2.4
After etching MD % 0.008
After etching TD 0.007
After E-0.5/150 MD 0.052
After E-0.5/150 TD 0.035
Flammability UL A + E-168/70 94VTM-0
  ED (TP4S) 18-100-18

The sample thickness is 0.1mm.

Our Halogen-free materials are based on JPCA-ES-01-2003 standard and others.
Contain; Chlorine:≤0.09wt%(900ppm), Bromine:≤0.09wt%(900ppm),
Chlorine+Bromine:≤0.15wt%(1500ppm)

The above data are typical values and not guaranteed values.