- The industry standard for high speed, ultra-low loss PCB material.
- Excellent HDI and thermal performance.
Circuit Board Materials
- Part Number
Low Dk glass cloth
Laminate R-5775(N)
Prepreg R-5670(N)
Normal glass cloth
Laminate R-5775(K)
Prepreg R-5670(K)
Laminate R-5775(G)
Prepreg R-5670(G)
Buried Resistor Copper Foil
Low Dk glass cloth
Laminate R-5775(S)
Normal glass cloth
Laminate R-5775(R)
- Application
- Detailed use
・Network
・Wireless
・Aerospace
・Wireless
・Aerospace
Any letters with parentheses ( ) at the end of a part number are for identification code in our company and are not included in the part numbers registered for UL certification.
Properties
Dk 3.34 Df 0.0037
@13GHz
@13GHz
Tg(DSC)
185°C
185°C
T288(with copper)
>120min
>120min
Video
Transmission loss performance Ranking in MEGTRON series
Frequency dependence by Transmission loss
Heat resistance of High Multi-layered
Dielectric property
Buried Resistor Copper Foil specification
General properties
| Item | Test method | Condition | Unit | MEGTRON6 R-5775(N) Low Dk glass cloth |
MEGTRON6 R-5775(K)/R-5775(G) Normal glass cloth |
|
|---|---|---|---|---|---|---|
| Glass transition temp.(Tg) | DSC | A | °C | 185 | 185 | |
| CTE z-axis | α1 | IPC-TM-650 2.4.24 | A | ppm/°C | 45 | 45 |
| α2 | 260 | 260 | ||||
| T288(with copper) | IPC-TM-650 2.4.24.1 | A | min | >120 | >120 | |
| Dielectric constant(Dk) | 13GHz | Balanced-type circular disk resonator |
C-24/23/50 | － | 3.34 | 3.62 |
| Dissipation factor(Df) | 0.0037 | 0.0046 | ||||
| Peel strength* | 1oz(35μm) | IPC-TM-650 2.4.8 | A | kN/m | 0.8 | 0.8 |
The sample thickness is 0.75mm.
* H-VLP Copper
The above data are typical values and not guaranteed values.
