Exhibition

Please refer to the following link for the latest exhibition information:

Industrial Devices & Solutions
Exhibition Information: https://industrial.panasonic.com/ww/exhibition-information
 

Revocation of our exhibition to “12th AUTOMOTIVE WORLD 2020”

Jan 7, 2020

We Electronic Materials Business Division of Panasonic decided the revocation of our exhibition to “12th AUTOMOTIVE WORLD 2020” that would be held at Tokyo Big Site (Aomi) from 15th to 17th of January, 2020.
As we already announce by official letter or on website, Panasonic Koriyama plant that is located in Koriyama central factory park had damages caused by Typhoon Hagibis in October. When we considered the current Koriyama plant situation and inconvenience on our customers, the priority of restoration activities was higher than that of the exhibition preparation with our time and efforts, then we decided this revocation. We apologize to all visitors who expect Panasonic exhibition booth. We Panasonic would make our best effort to restart the stable supply of our products and to satisfy expectations of our customers.
Finally, we really appreciate your supports to restart our production and your understanding to your inconvenience during the restoration activities from the damage.

JPCA Show 2019

Closed : Thank you for joining our Exhibition.

  • NPI English Presentation(Reservations NOT required)
    • Jun 7, 11:30-12:00 am
      Halogen-free Ultra-low transmission loss Multi-layer circuit board materials R-5375
      MAP

ECTC 2019

Closed : Thank you for joining our Exhibition.

  • Official web Site
  • Date : May 28 (Tue) - 31 (Fri)
  • Place : The Cosmopolitan of Las Vegas
  • Booth No. : #216
  • Exhibition Product
    • IC substrate materials
    • Encapsulation materials/Assembly materials
  • Seminar session
    • May 30, 4:20 pm
      "Solution method of warpage behavior for ultra-thin FC-CSP by control of EMC properties"

CMSE 2019

Closed : Thank you for joining our Exhibition.

SEMICON China 2019

Closed : Thank you for joining our Exhibition.

  • Official web Site
  • Date : Mar 20(Wed) - 22(Fri)
  • Place : Shanghai New International Expo Centre
  • Exhibition Product
    • Semiconductor Encapsulation Materials/Reinforcement Materials
    • IC Substrate Materials

DESIGN CON 2019

Closed : Thank you for joining our Exhibition.

  • Official web Site
  • Date : Jan 29 (Tue) - 31 (Thu)
  • Place : Santa Clara Convention Center
  • Booth No. : #753
  • Exhibition Product
    • For ICT infrastructure equipment multi-layer circuit board materials MEGTRON
    • For mobile products / automotive components flexible circuit board materials FELIOS LCP

AUTOMOTIVE WORLD Tokyo 2019

Closed : Thank you for joining our Exhibition.

Exhibition Product

Circuit Board Materials

  • Halogen-free ultra-low transmission loss Circuit board materials R-5515
  • High heat resistance Halogen-free Multi-layer circuit board materials R-1566(S)

Materials for Encapsulation / Mounting Reinforcement

  • High heat resistance Secondary mounting Underfill materials
  • Encapsulation material for IPM
  • Delamination free Surface mounting semiconductor encapsulation materials

Advanced Films / Touch Panel Sensor

  • Anti-Rainbow Film
  • Anti-Reflection Film
  • Index-Matching Hard Coat Film
  • Thermal Insulation Optical Film
  • Sensor Films for Large Touchscreen
  • For Low Retardation Film Sensor Material

Plastic Molding Compound

  • Laser Welding PBT Molding Compound

Scanning Laser Plastic Welding Machine

  • Galvano scanning system Laser Plastic Welding Machine

Connectors for Automotive application

  • Board to Wire Connectors
  • Board to FPC Connectors

Highly-functional Film Expo 2018(Closed : Thank you for joining our Exhibition.)

  • Official web Site
  • Date : Dec 5 (Wed) - 7 (Fri)
  • Time : 10:00 - 18:00 (The last date 17:00)
  • Place : Makuhari Messe 4th Hall
  • Booth No. : 24-52
  • Exhibition Product
    1. Advanced films
      • Anti-Rainbow Film
      • Anti-Reflection Film
      • Index-Matching Hard Coat Film
      • Thermal Insulation Optical Film
    2. Sensor films
      • Sensor Films for Large Touchscreen
      • For Low Retardation Film Sensor Material
    3. Plastic molding compound
      • Laser welding PBT molding compound
      • Liquid Crystal Polymer molding compound for camera module
    4. Adhesive
      • Time-lagged UV curing adhesive
      • Low-temperature curing adhesive
      • Potting material
    5. Scanning Laser Plastic Welding Machine
      • Galvano scanning system Laser Plastic Welding Machine

C-TOUCH & DISPLAY Shenzhen 2018(Closed : Thank you for joining our Exhibition.)

AUTOMOTIVE WORLD Nagoya(Closed : Thank you for joining our Exhibition.)

  • Official web Site
  • Date : Sep 5(Wed) - 7(Fri)
  • Place : Portmesse Nagoya, Japan
  • Exhibition Product
    • Halogen-free Ultra-low transmission loss Circuit board materials R-5515 (under development)
    • High heat resistance Halogen-free Multi-layer circuit board materials R-1566(S)
    • High heat resistance Secondary mounting Underfill materials CV5794series, CV5797series
      ⇒Sep 3rd, 2018 Press Release | Panasonic Commercializes Heat Resistant Underfill CV5794 Designed to Improve the Reliability of Automotive Electronics
    • For Automotive IC package Delamination free surface mounting semiconductor encapsulation materials CV8213series (under development)
    • High weather resistance & Anti-Fouling hard coat film
    • Rainbow unevenness reduction film
    • Reflection reduction film
    • Sensor films for large-screen touch panel
    • Low retardation film touch panel sensor material (under development)

SEMICON Taiwan 2018(Closed : Thank you for joining our Exhibition.)

  • Official web Site
  • Date : Sep 5(Wed) - 7(Fri)
  • Place : Taipei Nangang Exhibition Hall 1, 4F
  • Exhibition Product
    • WLP/PLP encapsulation materials

Touch Taiwan 2018(Closed : Thank you for joining our Exhibition.)

  • Official web Site
  • Date : Aug 29(Wed) - 31(Fri)
  • Place : Taipei Nangang Exhibition Hall 1, 4F
  • Exhibition Product
    • Advanced Films

AUTOMOTIVE WORLD CHINA(Closed : Thank you for joining our Exhibition.)

  • Official web Site
  • Date : Aug 28(Tue) - Aug 30(Thu)
  • Place : Shenzhen Convention & Exhibition Center
  • Exhibition Product
    • Laser welding PBT molding compounds
    • High heat resistance Secondary mounting Underfill materials

JPCA Show 2018(Closed : Thank you for joining our Exhibition.)

PCIM Europe 2018(Closed : Thank you for joining our Exhibition.)

  • Official web Site
  • Date : June 5 (Tue) - 7 (Thu)
  • Place : Nuernberg Messe
  • Booth No. : 6-347
  • Exhibition Product
    • Encapsulation materials

ECTC 2018(Closed : Thank you for joining our Exhibition.)

  • Official web Site
  • Date : May 29 (Tue) - June 1 (Fri)
  • Place : Sheraton San Diego Hotel & Marina
  • Booth No. : #708
  • Exhibition Product
    • IC substrate materials
    • Encapsulation materials
  • Poster session (at Northern Hemisphere Foyer)
    • May 30, 2:00-4:00 pm
      Low Dielectric Properties Encapsulation for High Frequency Devices
    • May 31, 9:00-11:00 am
      3D Stacking Process with Thermo-Sonic bonding Using Non-Conductive film

SEMICON China 2018(Closed : Thank you for joining our Exhibition.)

  • Official web Site
  • Date : Mar 14 (Wed) - 16 (Fri)
  • Place : Shanghai New International Expo Centre
  • Booth No. : #5360
  • Exhibition Product
    • Semiconductor Encapsulation Materials (WLP/PLP/, MUF, CUF)
    • Solder paste

DESIGN CON 2018(Closed : Thank you for joining our Exhibition.)

  • Official web Site
  • Date : Jan 31 (Wed) - Feb 1 (Thu)
  • Place : Santa Clara Convention Center
  • Booth No. : #654
  • Exhibition Product
    • For ICT infrastructure equipment multi-layer circuit board materials MEGTRON
    • For mobile products / automotive components flexible circuit board materials FELIOS LCP

PWB EXPO 2018(Closed : Thank you for joining our Exhibition.)

C-TOUCH & DISPLAY Shenzhen 2017(Closed : Thank you for joining our Exhibition.)

  • Official web Site
  • Date : Nov 24 (Fri) - 26 (Sun)
  • Place : Shenzhen Convention & Exhibition Center
  • Booth No. : 1B21
  • Exhibition Product : Advanced Films, Touch panel sensor

CEATEC JAPAN 2017(Closed : Thank you for joining our Exhibition.)

  • Official web Site
  • Date : Oct 3 (Tue) - Oct 6 (Fri)
  • Time : 10:00-17:00
  • Place : Makuhari Messe
  • Exhibition Product : WEARABLE MAKER PATCH

Touch Taiwan 2017(Closed : Thank you for joining our Exhibition.)

  • Official web Site
  • Date : Sep 20 (Wed) - Sep 22 (Fri)
  • Place : Taipei Nangang Exhibition Hall
  • Exhibition Product : Advanced Films, Touch panel sensor

JPCA Show 2017(Closed : Thank you for joining our Exhibition.)

  • Official web Site
  • Date : Jun 7 (Wed) - 9 (Fri)
  • Time : 10:00 - 17:00
  • Place : Tokyo Big Sight East Hall 7C-34
    MAP
  • Exhibition Product

    ■Circuit Board Materials - Electronic Materials Business Division

    ■Connectors - Electromechanical Control Business Division

    • High current connectors
    • Connectors for automotive application

    ■MID solution 3D packaging devices - Electromechanical Control Business Division

    • MIPTEC (Microscopic Integrated Processing Technology)
      *This product will be on display in the "3D-MID Pavilion Booth" East 7 Hall 7A-47-09.
  • NPI Presentation
    Theme Low transmission loss halogen-free high heat dissipation circuit board materials
    Date (Time) June 8 (Thu) 11:30 - 12:00

ECTC 2017(Closed : Thank you for joining our Exhibition.)

Adhesion & Joining EXPO - Highly-functional Material Week 2017 -(Closed : Thank you for joining our Exhibition.)

  • Official web Site
  • Date : Apr 5 (Wed) - 7 (Fri)
  • Time : 10:00 - 18:00 (The last date 17:00)
  • Place : Tokyo Big Sight East 6th Hall
  • Booth No. : #21-50
  • Exhibition Product

    ■Advanced films

    Details: Advanced films Fine Tiara series
    • Anti-Fingerprint/Anti-Scratch hard coat film
      Super high hardness hard coat film
    • For ITO use index-matching hard coat film
      For metal mesh use hard coat film
    • Super retarder HC/AR film
      AG-LR film
    • Window film for architecture
    • Decorative film
    • Polyimide base film

    ■Sensor films

    ■Plastic molding compound

    ■Adhesive

    ■Scanning Laser Plastic Welding Machine

    • Galvano scanning system Laser Plastic Welding Machine

DESIGN CON 2017(Closed : Thank you for joining our Exhibition.)

  • Official web Site
  • Date : Feb 1 (Wed) - 2 (Thu)
  • Place : Santa Clara Convention Center
  • Booth No. : #407
  • Exhibition Product
    • For ICT infrastructure equipment multi-layer circuit board materials MEGTRON
    • For mobile products flexible circuit board materials FELIOS
    • For mobile products / automotive components flexible circuit board materials FELIOS LCP

PWB EXPO 2017(Closed : Thank you for joining our Exhibition.)

  • Official web Site
  • Date : Jan 18 (Wed) - 20 (Fri)
  • Time : 10:00 - 18:00 (The last date 17:00)
  • Place : Tokyo Big Sight West Hall W6-25
  • Exhibition Product

    ■Circuit Board Materials - Electronic Materials Business Division

    ■Developmental products - Electronic Materials Business Division

    • Semiconductor encapsulation materials for WLP
    • Stretchable materials

    ■FPC/FFC connectors - Electromechanical Control Business Division

    • FPC/FFC connectors for high speed transmission
    • Board to FPC connectors and Board to Wire connectors for automotive application

C-TOUCH & DISPLAY Shenzhen 2016(Closed : Thank you for joining our Exhibition.)

  • Official web Site
  • Date : Nov 24 (Thu) - 26 (Sat)
  • Place : Shenzhen Convention & Exhibition Center
  • Booth No. : 1B50
  • Exhibition Product : Advanced Films, Touch panel sensor

Printed Electronics USA(Closed : Thank you for joining our Exhibition.)

JPCA Show 2016(Closed : Thank you for joining our Exhibition.)

  • Official web Site
  • Date : June 1 (Wed) - 3 (Fri)
  • Time : 10:00 - 17:00
  • Place : Tokyo Big Sight East 2 Hall 2D-24
  • Exhibition Product

    Circuit Board Materials

    Major application Exhibition Product Feature
    IC package Low stress materials for thinner IC substrate
    "MEGTRON GX" R-G525
    ⇒May 30th, 2016 Press Release
    Panasonic Commercializes a Substrate Material for Semiconductor Packages
    Featuring Reduced Internal Stress that Leads to Lower Warpage
    Low stress
    Excellent warpage performance
    Considerable cost advantage (E-glass)
    Mobile products Flexible circuit board materials resin coated copper foil
    "FELIOS FRCC" R-FR10
    Can be multi-layered thin
    Decrease a manufacture process
    Halogen-free
    Low Dk halogen-free multi-layer circuit board materials
    R-A555(W)
    Low Dk
    Low CTE
    High heat resistance
    ICT infrastructure
    equipment
    Ultra-low transmission loss multi-layer circuit board materials
    "MEGTRON7" R-5785
    High speed & ultra-low transmission loss
    High reliability
    Lead-free soldering
    • High heat resistance high reliability glass epoxy multi-layer materials "HIPER series"
    • High thermal dissipation materials "ECOOL series"

    Automotive Connector

    MID solution 3D packaging devices

    • MIPTEC (Microscopic Integrated Processing Technology)
      *This product will be on display in the "3D-MID Pavilion Booth" East 3 Hall 3F-08-03.

ECTC 2016(Closed : Thank you for joining our Exhibition.)

  • Official web Site
  • Date : May 31 (Tue) - June 3 (Fri)
  • Place : The Cosmopolitan of Las Vegas (NV, USA)
  • Exhibition Products
    • IC substrate materials MEGTRON GX series
    • Semiconductor encapsulation materials ECOM series

7th Film Tech Japan (Highly-functional Film Expo)(Closed : Thank you for joining our Exhibition.)

  • Official web Site
  • Date : April 6 (Wed) - 8 (Fri), 2016
  • Place : Tokyo Big Sight
  • Booth No. : E27-2 in East hall 6
  • Exhibition Products
    Exhibition Products Major Application
    For ITO film use index matching hard coat film Touch panel
    Super retardation control hard coat / AR film (SRF) Automotive touch panel
    Ultra-low reflection AR film Various displays
    Ultra-high hardness hard coat film Smartphone, Tablet
    For outside (window) use film Building glass, Automotive glass
    Advanced coating materials Various displays
    Sensor films for large-screen touch panel PC, Signage, Electronic blackboard
    UV curing glue "Fine Glue" Smartphone, Camera module, etc.
    PP molding compounds with diffusion and reflection
    "FULL BRIGHT PP"
    Signboard lighting for stores
    Lighting for plant factory
    Automotive (Meter panel, Interior light), etc.
    Laser welding PBT molding compounds
    "FULL BRIGHT PBT"
    Automotive switch, Sensor, ECU, etc.
  • Product development Press Release

THE LED SHOW 2016(Closed : Thank you for joining our Exhibition.)

  • Official web Site
  • Date : March 1 (Tue) - 3 (Thu), 2016
  • Place : Santa Clara Convention Center, U.S.
  • Exhibition Product : Plastic molding compounds "FULL BRIGHT"

DESIGN CON 2016(Closed : Thank you for joining our Exhibition.)

  • Official web Site
  • Date : January 20 (Wed) - 21 (Thu), 2016
  • Place : Santa Clara Convention Center, U.S.

PWB EXPO 2016(Closed : Thank you for joining our Exhibition.)

  • Official web Site
  • Date : Jan 13 (Wed) - 15 (Fri)
  • Time : 10:00 - 18:00 (The last date 17:00)
  • Place : Tokyo Big Sight East Hall E48-002
  • Exhibition Product

    ■Circuit Board Materials, Semiconductor Encapsulation Materials - Electronic Materials Business Division

    Application Exhibition products Feature
    Automotive Multi-layer Circuit Board Materials for Millimeter wave radar "MEGTRON7", "MEGTRON6" Good electrical properties
    at high frequency
    Flexible Circuit Board Materials for Millimeter wave radar "FELIOS LCP"
    Multi-layer Circuit Board Materials for Electronic Control Unit "MEGTRON2", "HIPER series",
    "R-1566"
    High heat resistance
    High reliability
    ICT infrastructure Multi-layer Circuit Board Materials for Server, Router and Base station "MEGTRON series" Low transmission loss
    High heat resistance
    LED lightings Plastic Molding Compounds for LED "FULL BRIGHT" High reflectance
    Circuit board materials for LED "ECOOL series" High heat dissipation
    IC package Circuit board materials for IC substrate "MEGTRON GX series" Low warpage
    "Semiconductor Encapsulation Materials", "Liquid Encapsulant" High heat resistance
    High reliability
    New product Resin Reinforcement Low Temperature Solder Paste Low-temperature soldering
    High joint strength
    No scattering of flux
    Fine-Wiring electrode films for touch panel use Capacitance-type
    Highly sensitive
    For large-screen
    Under development Stretchable Resin Film (*) Embodiment electronics
    which can be
    deformed freely
    * Dec 24th, 2015 Press Release "Panasonic Develops a Stretchable Resin Film and Its Application Materials For Stretchable Electronics"

    ■Molded Interconnect Devices - Electromechanical Control Business Division

    • MIPTEC (Microscopic Integrated Processing Technology)
    • LDS (Laser Direct Structuring)

IC CHINA 2015(Closed : Thank you for joining our Exhibition.)

  • Official web Site
  • Date : Nov 11 (Wed) - 13 (Fri), 2015
  • Place : Shanghai New International Expo Center (SNIEC) W5
  • Exhibition Products
    • Halogen-free IC substrate materials MEGTRON GX series
    • Semiconductor encapsulation materials ECOM series

International LED & OLED EXPO 2015 (Korea)(Closed : Thank you for joining our Exhibition.)

  • Official web Site
  • Date : June 23 (Tue) - 26 (Fri), 2015
  • Place : KINTEX (Korea International Exhibition Center)
  • Exhibition Products
    • Thermosetting plastic molding compound for LED reflectors “FULL BRIGHT UP”
    • Thermoplastic molding compound for optical parts “FULL BRIGHT PP”

Guangzhou International Lighting Exhibition(Closed : Thank you for joining our Exhibition.)

  • Official web Site
  • Date : June 9 (Tue) - 12 (Fri), 2015
  • Place : China Import and Export Fair Complex
  • Exhibition Products
    • High thermal dissipation circuit board materials “ECOOLseries”
    • Glass composite copper clad laminates “CEM-3”
    • Thermosetting plastic molding-materials for LED reflectors “FULL BRIGHT”
    • Other LED related products

JPCA Show 2015(Closed : Thank you for joining our Exhibition.)

  • Official web Site
  • Date : June 4 (Wed) - 6 (Fri)
  • Time : 10:00 - 17:00
  • Place : Tokyo Big Sight East 2 Hall 2E-30
  • Exhibition Product

    ■Circuit Board Materials

    Solution Exhibition Product
    THINNER Halogen-free IC substrate materials MEGTRON GX series
    Flexible Circuit Board Materials FELIOS series
    Low Dk Halogen-free multi-layer circuit board materials
    HIGH-SPEED Low Dk . Low Df and High Tg Multi-layer Circuit Board Materials MEGTRON series
    Flexible Circuit Board Materials FELIOS LCP
    HEAT High heat resistance high reliability Multi-layer Circuit Board Materials HIPER series
    High Thermal Conductive Circuit Board Materials ECOOL series
    High Thermal Conductive Insulation Sheet

    ■MID Solution

    • MIPTEC (Microscopic Integrated Processing Technology)
    • LDS (Laser Direct Structuring)

ECTC 2015(Closed : Thank you for joining our Exhibition.)

  • Official web Site
  • Date : May 26 (Tue) - 29 (Fri)
  • Place : Sheraton San Diego Hotel & Marina (San Diego, CA, USA)
  • Exhibition Products
    • Halogen-free IC substrate materials MEGTRON GX series
    • Semiconductor encapsulation materials ECOM series

6th Film Tech Japan (Highly-functional Film Expo)(Closed : Thank you for joining our Exhibition.)

DESIGN CON 2015(Closed : Thank you for joining our Exhibition.)

  • Official web Site
  • Date : January 28 (Wed) - 29 (Thu), 2015
  • Place : Santa Clara Convention Center, U.S.
  • Exhibition Product :
    • Ultra-low transmission loss multi-layer circuit board materials for ICT infrastructure equipment
      “MEGTRON7”, “MEGTRON6”
    • LCP (Liquid Crystal Polymer) flexible circuit board materials For mobile products and automotive components
      “FELIOS LCP”
    • Low Df & halogen-free circuit board materials for IC substrate
      “MEGTRON GX” Laminate:R-G515 Prepreg:R-G510

PWB EXPO 2015(Closed : Thank you for joining our Exhibition.)

  • Official web Site
  • Date : January 14(Wed) - 16(Fri), 2015
  • Place : Tokyo Big Sight
  • Exhibition Product :
    • Multi-layer circuit board materials for Automotive components
      →Multi-layer circuit board materials for millimeter-wave radar “MEGTRON7/6”, “FELIOS LCP”
      →High reliability circuit board materials “HIPER series”
      →High thermal conductive materials “ECOOL series”
    • Multi-layer circuit board materials for ICT infrastructure equipment “MEGTRON series”
    • High thermal conductive rubber sheet “TIM”
    • LED package reflector material “FULL BRIGHT”
    • 3D packaging technology “MIPTEC”, “LDS”

AUTOMOTIVE ENGINEERING EXPOSITION 2014(Closed : Thank you for joining our Exhibition.)

  • Official web Site
  • Date : December 11 (Thu) - 12 (Fri), 2014
  • Place : Nagoya Internarional Exhibition Hall, Japan
  • Exhibition Product :
    • High heat resistance phenolic molding compounds for automotive components
    • High heat dissipation unsaturated polyester resin molding compounds for automotive components
    • Long-term reliable PBT molding compounds for automotive components
    • Light diffusion/reflection PP molding compounds for LED (optical parts) FULL BRIGHT PP
    • Semiconductor encapsulation materials ECOM SuperFine, ECOM E
    • Liquid encapsulant for IC package ECOM FineFlow
    • High thermal conductive rubber sheet TIM

2014 LED EXPO 2014 (Korea)(Closed : Thank you for joining our Exhibition.)

  • Official web Site
  • Date : June 24 (Tue) - 27 (Fri)
  • Place : KINTEX (Korea International Exhibition Center)
  • Exhibition Product :
    • Plastic molding material for LED reflector / optical parts
      “FULL BRIGHT” series

2014 LED Lighting Taiwan(Closed : Thank you for joining our Exhibition.)

  • Official web Site
  • Date : June 17 (Tue) - 19 (Thu), 2014
  • Place : TWTC Nangang Exhibition Hall
  • Exhibition Product :
    • Plastic molding material for LED reflector / optical parts
      “FULL BRIGHT” series

2014 Guangzhou International Lighting Exhibition(Closed : Thank you for joining our Exhibition.)

  • Official web Site
  • Date : June 9 (Mon) - 12 (Thu), 2014
  • Place : China Import and Export Fair Complex
  • Exhibition Product :
    • High thermal dissipation circuit board materials

      “ECOOLseries”
    • Glass composite copper clad laminates

      “CEM-3”

JPCA Show 2014(Closed : Thank you for joining our Exhibition.)

  • Official web site
  • Date : June 4 (Wed) - 6 (Fri)
  • Time : 10:00 - 17:00
  • Place : Tokyo Big Sight East 2 Hall 2E-30
  • Exhibition Product
    Application Product
    For ICT infrastructure equipment Low Dk, Low Df and High Tg for Multi-layer Circuit Board Materials
    MEGTRON series, NEWMEGTRON 7
    For IC Substrates IC Substrate Materials MEGTRON GX series
    For Mobile products Flexible Circuit Board Materials FELIOS series
    Halogen-free series
    For LED Lighting
    For Automotive components
    High thermal conductive circuit board materials ECOOL series
    For Automotive components High Reliability Glass Epoxy Multi-layer Materials HIPER series
    For Touch panel Fine-wiring electrode film
    For various devices High thermal conductive rubber sheet
    Others MIPTEC 3D Packaging Technology
  • NPI Presentation
    Theme Low Dk . Low Df and High Tg for Multi-layer Circuit Board Materials “MEGTRON7”
    Date (Time) June 5 (Thu) 11:30 - 12:00
    Place East 6 Hall D Venue
    Theme For mobile products low Dk halogen-free multi-layer circuit board materials “R-A555”
    Date (Time) June 5 (Thu) 12:50 - 13:20
    Place East 6 Hall D Venue