Electronic MaterialsTOPProductsDownloadsExhibitionNewsAbout usLocationSeptember 12, 2025多层基板材料“MEGTRON”的产能5年提高2倍April 21, 2025MEGTRON7 Qualified for PCB at European Space Agency ESAFebruary 3, 2025Partial Withdrawal Third-Party Certification for Electronic MaterialsJanuary 29, 2025Price Revision of Flexible Circuit Board MaterialsNovember 1, 2024Investigation Results on Quality Irregularities by the External Investigation Committee and Endeavors Taken at PIDOctober 31, 2024Update of Part Number List of Irregularities in Third-party CertificationSeptember 6, 2024Update of Part Number List of Irregularities in Third-party CertificationJuly 25, 2024Price Revision of Circuit Board MaterialsJuly 1, 2024Partial withdrawal of third-party certification registration from electronic materialsJune 3, 2024Partial withdrawal of third-party certification registration from electronic materialsMay 22, 2024Update of Part Number List of Irregularities in Third-party CertificationMay 20, 2024Withdrawal of Certifications of International Standard for Quality Management Systems, IATF 16949Apr 26, 2024Update of Part Number List of Irregularities in Third-party CertificationApr 12, 2024Update of Part Number List of Irregularities in Third-party CertificationMar 22, 2024Withdrawal of Certifications of International Standard for Quality Management Systems, ISO 9001Mar 15, 2024Part Number List of Irregularities in Third-party CertificationMar 15, 2024Identification of irregularities in additional part numbers and an additional factory in third-party certificationFeb 7, 2024Temporary Suspension of Certifications of International Standard for Quality Management Systems, IATF 16949Feb 2, 2024Temporary Suspension of Certifications of International Standard for Quality Management Systems, ISO 9001Jan 12, 2024Irregularities in third-party certification of electronic materials and establishment of the external investigation committeeJan 11, 2024在恶劣太空环境下的暴露实验中验证我公司电子材料的耐久性May 15, 2023行业首创丨松下最新研发高热传导性多层基板用薄膜“R-2400”Aug 30, 2022Price Revision on Semiconductor Encapsulation MaterialsJan 18, 2022Panasonic Develops MEGTRON 8 Multi-Layer Circuit Board Materials Featuring Low Transmission Loss for High-Speed Communication Networking EquipmentNov 10, 2021Price Revision on Semiconductor Encapsulation MaterialsAug 6, 2021Introduction of New Material For Next Generation Display Development TOUGHTELONJun 22, 2021Panasonic Commercializes a New Semiconductor Substrate Material Designed to Improve ReliabilityMar 2, 2021Panasonic Commercializes Temperature-Resistant Sidefill for Surface Mount Assembly ReinforcementFeb 25, 2021Panasonic Commercializes R-5410 Halogen-free Ultra-low Transmission Loss Multi-Layer Circuit Board Material for Millimeter-Wave AntennasMay 19, 2020Exhibition information: ECTC 2020 Virtual ConferenceJan 7, 2020Revocation of our exhibition to “12th AUTOMOTIVE WORLD 2020”Oct 18, 2019Current damage report and recovery status at Panasonic Koriyama plant due to Typhoon HagibisJan 21, 2019Panasonic Commercializes Halogen-free Multi-layer Circuit Board Material (Halogen-free MEGTRON6) for Communications Infrastructure EquipmentDec 21, 2018Exhibition infomation : AUTOMOTIVE WORLD Tokyo 2019Dec 13, 2018Panasonic to Bolster Substrate Material Business for Semiconductor Packages and Modules in China and North East Asian RegionSep 3, 2018Panasonic Commercializes Heat Resistant Underfill CV5794 Designed to Improve the Reliability of Automotive ElectronicsAug 29, 2018Panasonic Commercializes Granular Epoxy Mold Compound (EMC) Semiconductor Encapsulation Materials for FOWLP and PLPJun 4, 2018Panasonic Develops Glass Composite Circuit Board Material that Improves Parts Mounting ReliabilityMay 29, 2018Panasonic Develops an Ultra-low Transmission Loss Circuit Board Material for Semiconductor Packages and ModulesMar 9, 2018Panasonic Announces Price Revisions for Copper Clad Laminates, Prepregs, and Mass LaminationsFeb 8, 2018Panasonic Launches Production of Molded Underfill Semiconductor Encapsulation Materials in ShanghaiJan 11, 2018Panasonic Develops "Halogen-free Ultra-low Transmission Loss Circuit Board Material" for Millimeter-wave Band AntennasJun 1, 2017Panasonic Commercializes "High Thermal Conductivity, Low Transmission Loss Halogen-free Multi-layer Circuit Board Material" for Wireless Base StationsMay 12, 2017Panasonic Announces Price Revisions for Copper Clad Laminates, Prepregs, and Mass LaminationsFeb 3, 2017Panasonic Develops Low-temperature Curing Secondary Mounting Underfill Material that Improves Mounting Reliability of Automotive PartsJan 17, 2017Panasonic Commercializes Low Transmission Loss Flexible Multi-layer Circuit Board MaterialsDec 27, 2016Price Revision for Copper clad Laminates and Mass LaminationsDec 22, 2016Panasonic Commercializes High Heat Resistance Halogen-free Multi-layer Circuit Board Material for Automotive UseAug 25, 2016Panasonic Commercializes "Time-lagged UV Curing Adhesive" Suitable for Assembly of Mobile Phone Housings and UV-Protection PanelsMay 30, 2016Panasonic Commercializes a Substrate Material for Semiconductor Packages Featuring Reduced Internal Stress that Leads to Lower WarpageMay 26, 2016Panasonic Commercializes "Sheet-Form Encapsulation Material for Coreless Package Substrates"Apr 5, 2016Panasonic Develops Light Diffusion Polypropylene Resin Molding Compounds "FULL BRIGHT" PPMar 18, 2016Panasonic Commercializes a High Dielectric Constant Encapsulation Molding Compound Suitable for Finger-Print Sensor PackagesMar 3, 2016Panasonic Commercializes the Industry's First Sulfur-free Encapsulation Molding Compound for Copper WiresFebruary 27 ,2012Announcing the release of the thermosetting plastic molding-materials“Full Bright”used for LED reflectors
