Semiconductor Device Materials

Panasonic Electronic Materials Division launches a new product brand for the Semiconductor Device Materials business.
The LEXCM brand now comprises all of the Semiconductor Device Materials; IC packaging materials
(which includes substrates, encapsulants and underfills) and electronic assembly materials.
Additionally, the IC substrate materials' brand is transitioning from MEGTRON GX to LEXCM GX.

IC Substrate Materials

Contribute to IC substrates as thinner and smaller and low warpage.

IC Substrate Materials
Major application Product name Product number Features / Proposals Detailed application
IC package
IC package
Narrow pitch corresponding circuit board materials MEGTRON GX
series
Contribute to IC substrates as thinner and smaller and low warpage
IC package
IC package
Ultra-low transmission loss Circuit board materials for IC substrate/Module MEGTRON GX
Laminate :
R-G545L, R-G545E
Prepreg :
R-G540L, R-G540E
  • Df 0.003 Dk 3.5@12GHz
  • CTE x, y-axis 10ppm/°C
  • Tg (DMA) 230°C
  • IC PKG for base station application, Module part, etc.
IC package
IC package
High modulus Low CTE IC substrate materials MEGTRON GX
Laminate :
R-G535S, R-G535E
  • CTE x, y-axis 4-6ppm/°C
  • Low Package Warpage
    (FC-BGA)
  • Good MTH Processability
    (Mechanical Through Hole)
  • IC substrate(FC-BGA)
IC package
IC package
Low stress materials for thinner IC substrate MEGTRON GX
Laminate :
R-G525T, R-G525F
Prepreg :
R-G520T, R-G520F
  • Low stress
  • Excellent warpage performance
  • Considerable cost advantage
    (E-glass)
  • FC-CSP
IC package
IC package
Low CTE Ultra-thin IC substrate materials MEGTRON GX
Laminate :
R-G515S, R-G515E
Prepreg :
R-G510S, R-G510E
  • CTE x,y-axis 4-6ppm/°C
    (Low CTE glass cloth)
  • Low warpage
  • Ultra-thin,
    Excellent moldability
  • IC substrate
    CSP (PoP-Bottom, Flip-Chip, Memory, Module, etc.)
IC package
IC package
Low CTE IC substrate materials Designed to Improve Reliability MEGTRON GX
Laminate :
R-1515V,R-1515K
  • CTE x, y-axis 3-5ppm/°C
    (Low CTE glass cloth)
  • Stress Relaxation
  • Good Thickness Variation
  • IC substrate FC-BGA
    (CPU, GPU, FPGA, ASIC, etc.)
IC package
IC package
Narrow pitch corresponding circuit board materials MEGTRON GX
Laminate : R-1515W
Prepreg : R-1410W
  • High heat resistance
  • Low CTE
  • Mechanical drilling-ability
  • FC-BGA
IC package
IC package
Narrow pitch corresponding circuit board materials MEGTRON GX
Laminate : R-1515A
Prepreg : R-1410A
  • High heat resistance
  • Mechanical drilling-ability
  • Halogen-free
  • FC-BGA
IC package
IC package
Ultra-thin circuit board materials MEGTRON GX
Laminate : R-1515E
Prepreg : R-1410E
  • Low warpage
  • Corresponding to ultra-thin
  • Halogen-free
  • CSP

Semiconductor Encapsulation Materials

Semiconductor Packaging Encapsulation Materials for Advanced Package

Contribute to improving the reliability of advanced semiconductor package such as wafer level package, FC CSP/BGA, Wifi module, etc.

Semiconductor Packaging Encapsulation Materials for Advanced Package
Major application Product name Product number Features / Proposals Detailed application
IC package
IC package
Semiconductor Packaging Encapsulation Materials for Advanced Package Contribute to improving the reliability of advanced semiconductor package such as wafer level package, FC CSP/BGA, Wifi module, etc.
IC packageMobile products
IC package
Mobile products
Encapsulation Materials for FOWLP/PLP LEXCM CF
CV8511C
LEXCM SF
CV2308
LEXCM LF
CV5788
  • Low stress
  • Low shrinkage
  • Low temp.curability
Over-molding and wafer back-coating of advanced semiconductor packages, such as WLPs (FOWLPs and FIWLPs) and PLPs, for sophisticated mobile and wearable devices
IC packageMobile products
IC package
Mobile products
Molded Underfill(MUF) Semiconductor encapsulation Molding compounds LEXCM CF
CV8710
CV8713
  • Saving process time
  • for Narrow gap/pitch
  • Low warpage
Advanced IC Packages(Flip-chip package such as FC-CSP, FC-SiP module, etc.)
IC packageMobile products
IC package
Mobile products
Capillary Underfill(CUF) Semiconductor encapsulation materials LEXCM LF
CV5300
CV5350
  • High fluidity
  • for Narrow gap/pitch
  • Reduced void/bleed
High-density Advanced IC Packages(BGA, CSP, etc.)
IC package
IC package
Thin surface mounting semiconductor encapsulation materials LEXCM CF
CV8710
CV8760
  • Thinner
  • High-density wiring
  • Warpage control
High-density, advanced package for mobile devices(PoP,MCP,Mold underfill package, etc.)
IC package
IC package
For SMD module low warpage liquid encapsulant LEXCM LF
CV5386
CV5401
  • Warpage control
  • High adhesion
  • Reduced solder flash
Communication module (MAP, COB) for mobile devices such as notebook PC, digital camera, mobile phone, smartphone, tablet PC.

Semiconductor Packaging Encapsulation Materials for Automotive/Industrial equipment

Contribute to improving the reliability of semiconductor package such as a power device requiring automotive quality

Semiconductor Packaging Encapsulation Materials for Automotive/Industrial equipment
Major application Product name Product number Features / Proposals Detailed application
IC package
IC package
Semiconductor Packaging Encapsulation Materials for Automotive/Industrial equipment Contribute to improving the reliability of semiconductor package such as a power device requiring automotive quality
IC packageAutomotive components
IC package
Automotive components
For Automotive IC package Delamination free surface mounting semiconductor encapsulation materials LEXCM CF
CV8213 series
  • High adhesion, low stress
  • AEC-Q100/grade 0
  • for Clip-bond PKG
Surface mounting PKG: SOP, QFP, LQFP, DPAK, LFPAK, TOLL
IC package
IC package
For power modules high thermal conductive semiconductor encapsulation materials LEXCM CF
CV4180
CV4380
  • High heat dissipation
  • Stress reduction
  • High adhesion
Inverter module for major appliances and industrial motors, Automotive module
IC package
IC package
For high heat resistance power devices semiconductor encapsulation materials LEXCM CF
CV8540 series
  • High heat resistance
  • Low warpage, Low stress
  • High insulation
Power devices used in industry/Automotive inverters
IC package
IC package
Potting material LEXCM GF
CV5000 series
  • Low stress
  • High adhesion
Potting, Casting, etc.

Liquid Materials for Board level Underfill, Adhesives

Secondary mounting reinforcement of semiconductor package such as CSP/BGA, Adhesive bonding of camera module/image sensor

Liquid Materials for Board level Underfill, Adhesives
Major application Product name Product number Features / Proposals Detailed application
IC package
IC package
Liquid Materials for Board level Underfill, Adhesives Secondary mounting reinforcement of semiconductor package such as CSP/BGA, Adhesive bonding of camera module/image sensor
IC packageAutomotive components
IC package
Automotive components
High heat resistance Secondary mounting Sidefill materials LEXCM DF
CV5797 series
  • For large size PKG
  • Tg 160°C
  • Pot life: 72h
Surface mounting PKG: CSP, BGA, WLCSP, QFN, MLCC, Image sensor, etc.
IC packageAutomotive components
IC package
Automotive components
High heat resistance Secondary mounting Underfill materials LEXCM DF
CV5794 series
  • Tg 160°C
  • Compatible with the PKG
    size up to 20mm square
  • Pot life: 72h
Mount reinforcement of semiconductor packages and electronic parts for Automotive camera modules, Millimeter-wave radar modules, ECU
IC packageAutomotive components
IC package
Automotive components
Low-temperature curing Secondary mounting Underfill materials LEXCM DF
CV5350AS
  • Cures at a low temp of 80°C
  • Tg is 140°C or greater
Mount reinforcement of semiconductor packages and electronic parts for Automotive camera modules, Millimeter-wave radar modules, ECU, etc.
IC package
IC package
For secondary mounting reinforcement drop impact resistance liquid encapsulant LEXCM DF
CV5313
CV5314
  • Drop impact resistance
  • Underfill/Sidefill reinforcement
LSI package and SSD for mobile devices such as notebook PC, digital camera, mobile phones, smartphone and tablet PC.
IC package
IC package
Thermosetting/UV curing Adhesives LEXCM GF
CV5000 series
CV7000 series
  • Bonding of various materials
  • Solvent resistance
  • Time-lagged curing
Image Sensor, etc.