Semiconductor Packaging Encapsulation Materials for Automotive/Industrial equipment
Semiconductor Packaging Encapsulation Materials for Automotive/Industrial equipment
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Contribute to improving the reliability of semiconductor package
such as a power device requiring automotive quality
Semiconductor Encapsulation Materials/Adhesive
- For Automotive IC package Delamination free
surface mounting semiconductor encapsulation materials CV8213 - For Power modules High thermal conductive
semiconductor encapsulation materials CV4180, CV4380 - For Intelligent Power Module (IPM) High heat resistance
semiconductor encapsulation materials X8540 - Potting material CV5000
Line up
| Application | Our oroposal |
|---|---|
Power device |
High adhesion, low stress AEC-Q100/grade 0 for Clip-bond PKG |
|
For Power modules High thermal conductive High heat dissipation Stress reduction High adhesion |
|
|
For Intelligent Power Module (IPM) High heat resistance Low warpage, Low stress High heat resistance High volume resistivity |
|
Potting/Casting |
Potting material CV5000 Low stress High adhesion
|
