Electronic Materials
Application | Our oroposal |
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Power device![]() |
High adhesion, low stress AEC-Q100/grade 0 for Clip-bond PKG |
For Power modules High thermal conductive High heat dissipation Stress reduction High adhesion |
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For Intelligent Power Module (IPM) High heat resistance Low warpage, Low stress High heat resistance High volume resistivity |
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Potting/Casting![]() |
Potting material CV5000 Low stress High adhesion
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