半导体封装基板材料「LEXCM GX」系列

Circuit Board Materials

Electronic Materials

New branding announcement

  • Panasonic Electronic Materials Division launches a new business brand for the Semiconductor Device Materials business.
    The LEXCM brand now comprises all of the Semiconductor Device Materials; IC packaging materials (which includes substrates, encapsulants and underfills) and electronic assembly materials.
    Additionally, the IC substrate materials' brand is transitioning from MEGTRON GX to LEXCM GX.

Line-up

MEGTRON GX Line-up

General properties

Item  Test method Condition Unit R-G545L R-G545E R-G525T R-G525F R-1515E R-1515W R-1515A
Glass transition temp(Tg) DMA*2 A °C 230 230 270 270 270 250 205
Thermal decomposition temp(Td) TGA A °C 420 420 365 365 390 390 390
CTE x-axis α1 Internal method A ppm/°C 10 10 3-5 5-7 9 9 12
CTE y-axis 10 10 3-5 5-7 9 9 12
Dielectric constant(Dk)*1 1GHz IPC-TM-650 2.5.5.9 C-24/23/50 – 3.6 4.1 4.3 4.5 4.7 4.8 4.8
Dissipation factor(Df)*1 0.002 0.002 0.015 0.015 0.011 0.015 0.015
Volume resistivity IPC-TM-650 2.5.17.1 C-96/35/90 MΩ·cm – – 1×109 1×109 1×109 1×109 1×109
Surface resistivity MΩ – – 1×108 1×108 1×108 1×108 1×108
Water absorption IPC-TM-650 2.6.2.1 D-24/23 % 0.06 0.06 0.3 0.3 0.3 – –
Flexural modulus*1 JIS C 6481 25°C GPa 23 27 19 16 33 35 27
250°C – – 5-8 7-10 18 21 10
Peel strength 1 oz IPC-TM-650 2.4.8 A kN/m – – – – – 1.2 1.3
1/3oz
(12µm)		 0.6 0.6 0.6 0.6 0.9 0.9 0.9
Thickness line-up ｍｍ 0.04-0.4 0.04-0.4 0.04-0.2 0.04-0.2 0.04-0.2 0.20-0.8 0.10-0.8

The sample thickness is 0.1 mm.
*1 0.8mm
*2 R-G545L, R-G545E, R-G525T, R-G525F, R-1515E : Measurement in tensile mode
R-1515W, R-1515A : Measurement in bending mode

The above data are typical values and not guaranteed values.

Our Halogen-free materials are based on JPCA-ES-01-2003 standard.
Contain; Chlorine:≤0.09wt%(900ppm), Bromine:≤0.09wt%(900ppm),
Chlorine+Bromine:≤0.15wt%(1500ppm)

 

Related information

[ Product summary ]

[ Common information ]