半导体包装基板材料「MEGTRON GX」系列
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Electronic Materials
Item | Test method | Condition | Unit | R-G545L | R-G545E | R-G525T | R-G525F | R-1515E | R-1515W | R-1515A | |
Glass transition temp(Tg) | DMA*2 | A | °C | 230 | 230 | 270 | 270 | 270 | 250 | 205 | |
Thermal decomposition temp(Td) | TGA | A | °C | 420 | 420 | 365 | 365 | 390 | 390 | 390 | |
CTE x-axis | α1 | Internal method | A | ppm/°C | 10 | 10 | 3-5 | 5-7 | 9 | 9 | 12 |
CTE y-axis | 10 | 10 | 3-5 | 5-7 | 9 | 9 | 12 | ||||
Dielectric constant(Dk)*1 | 1GHz | IPC-TM-650 2.5.5.9 | C-24/23/50 | – | 3.6 | 4.1 | 4.3 | 4.5 | 4.7 | 4.8 | 4.8 |
Dissipation factor(Df)*1 | 0.002 | 0.002 | 0.015 | 0.015 | 0.011 | 0.015 | 0.015 | ||||
Volume resistivity | IPC-TM-650 2.5.17.1 | C-96/35/90 | MΩ·cm | – | – | 1×109 | 1×109 | 1×109 | 1×109 | 1×109 | |
Surface resistivity | MΩ | – | – | 1×108 | 1×108 | 1×108 | 1×108 | 1×108 | |||
Water absorption | IPC-TM-650 2.6.2.1 | D-24/23 | % | 0.06 | 0.06 | 0.3 | 0.3 | 0.3 | – | – | |
Flexural modulus*1 | JIS C 6481 | 25°C | GPa | 23 | 27 | 19 | 16 | 33 | 35 | 27 | |
250°C | – | – | 5-8 | 7-10 | 18 | 21 | 10 | ||||
Peel strength | 1 oz | IPC-TM-650 2.4.8 | A | kN/m | – | – | – | – | – | 1.2 | 1.3 |
1/3oz (12µm) |
0.6 | 0.6 | 0.6 | 0.6 | 0.9 | 0.9 | 0.9 | ||||
Thickness line-up | mm | 0.04-0.4 | 0.04-0.4 | 0.04-0.2 | 0.04-0.2 | 0.04-0.2 | 0.20-0.8 | 0.10-0.8 |
The sample thickness is 0.1 mm.
*1 0.8mm
*2 R-G545L, R-G545E, R-G525T, R-G525F, R-1515E : Measurement in tensile mode
R-1515W, R-1515A : Measurement in bending mode
The above data are typical values and not guaranteed values.
Our Halogen-free materials are based on JPCA-ES-01-2003 standard.
Contain; Chlorine:≤0.09wt%(900ppm), Bromine:≤0.09wt%(900ppm),
Chlorine+Bromine:≤0.15wt%(1500ppm)