| Glass transition temp.(Tg) :TMA,Temp. rising rate: 10°C/min (°C) |
140 |
| Solder heat resistance:JIS C6481,260°C solder float for 2min |
No abnormality |
| Heat resistance,1oz:JIS C6481 |
230°C 60min |
| Dielectric constant (Dk):1MHz,JIS C 6481 |
5.1 |
| Dissipation factor (Df):1MHz,JIS C 6481 |
0.016 |
| Insulation resistance:JIS C6481,C-96/20/65 (MΩ) |
1x108 |
| Tracking resistance:IEC 60112 (V) |
CTI≥600 |
| Thermal conductivity:Laser flash (W/m·K) |
1.10 |
| Flat-withstand voltage:ASTM D149 (kV/mm) |
43 |