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Multi-layer Circuit Board Materials for ICT infrastructure equipment "MEGTRON" series
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Urea molding compounds
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Functional films for HUD cover
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Anti-Rainbow and Anti-Blackout Films
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580(Ad) (1)
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1 x 10<sup>8</sup> *2 (1)
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3 (1)
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0.019 (1)
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1.2 *4 (1)
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0.8(4.6)
(ED:12μm) (1)
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Flammability:UL,A+E-168/70
94VTM-0 *5 (1)
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(Cu:12μm, PI:5μm,Ad:15μm) (1)
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*1 Condition: C-96/20/65, Unit : MΩ·m
- (121)
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*2 Condition: E-24/50+D-24/23
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*3 Measured by R-FR10/R-F775 25μm/ R-FR10 construction
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1.7 (4)
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0 (1)
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0.001 (1)
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0.003 (1)
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0.0047 (1)
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0.007 (3)
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0.021 (3)
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0.023 (1)
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0.033 (1)
0.036 (1)
0.04 (1)
0.0424 (1)
0.0436 (1)
0.0463 (1)
0.058 (1)
0.064 (2)
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Dimensional Stability.TD:IPC-TM-650.After Etching (%)
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-0.053 (1)
-0.049 (1)
-0.039 (1)
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0.001 (3)
0.0012 (1)
0.002 (2)
0.003 (1)
0.004 (2)
0.006 (1)
0.0069 (1)
0.0076 (1)
0.008 (1)
0.009 (3)
0.01 (3)
0.0102 (1)
0.012 (2)
0.0122 (1)
0.013 (1)
0.0156 (1)
0.0167 (1)
0.017 (3)
0.0171 (1)
0.0175 (1)
0.018 (1)
0.02 (4)
0.0209 (1)
0.021 (1)
0.022 (1)
0.0228 (1)
0.023 (1)
0.024 (1)
0.0247 (1)
0.025 (2)
0.0258 (1)
0.027 (2)
0.028 (1)
0.0285 (1)
0.0286 (1)
0.029 (1)
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0.032 (1)
0.033 (1)
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0.0599 (1)
0.06 (1)
0.068 (1)
0.0739 (1)
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Dimensional Stability.MD:IPC-TM-650.E-0.5/150 (%)
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-0.083 (1)
-0.082 (1)
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0.0012 (1)
0.005 (1)
0.0052 (1)
0.007 (1)
0.0072 (1)
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0.0082 (2)
0.0086 (1)
0.009 (4)
0.0092 (1)
0.0116 (1)
0.0146 (1)
0.0169 (1)
0.019 (1)
0.0242 (1)
0.025 (1)
0.028 (1)
0.034 (1)
0.035 (1)
0.04 (1)
0.045 (1)
0.05 (1)
0.054 (1)
0.06 (1)
0.067 (2)
0.07 (1)
0.0717 (1)
0.072 (1)
0.077 (1)
0.082 (1)
0.0821 (1)
0.088 (1)
0.089 (1)
0.092 (1)
0.0973 (1)
0.0996 (1)
0.108 (1)
0.121 (1)
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Dimensional Stability.TD:IPC-TM-650.E-0.5/150 (%)
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-0.28 (1)
-0.0807 (1)
-0.073 (1)
-0.0684 (1)
-0.066 (1)
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-0.037 (3)
-0.035 (2)
-0.0345 (1)
-0.0337 (1)
-0.0328 (1)
-0.03 (2)
-0.0296 (1)
-0.0293 (1)
-0.029 (2)
-0.028 (1)
-0.027 (1)
-0.026 (1)
-0.0259 (1)
-0.0255 (1)
-0.0251 (1)
-0.0242 (1)
-0.0215 (1)
-0.021 (1)
-0.0193 (1)
-0.019 (1)
-0.017 (1)
-0.0165 (1)
-0.0158 (1)
-0.015 (1)
-0.011 (2)
-0.01 (1)
-0.009 (2)
-0.0084 (1)
-0.008 (2)
-0.007 (1)
-0.003 (1)
-0.002 (1)
-0.001 (1)
0.001 (3)
0.002 (1)
0.0021 (1)
0.0026 (1)
0.003 (1)
0.004 (1)
0.0064 (1)
0.007 (1)
0.0072 (1)
0.008 (1)
0.0088 (1)
0.009 (2)
0.011 (1)
0.013 (2)
0.015 (1)
0.017 (1)
0.021 (1)
0.025 (1)
0.0274 (1)
0.028 (1)
0.0298 (1)
0.031 (1)
0.035 (1)
0.036 (1)
0.0375 (1)
0.04 (1)
0.0413 (1)
0.044 (1)
0.0464 (1)
0.048 (1)
0.053 (1)
0.054 (1)
0.0546 (1)
0.0562 (1)
0.0582 (1)
0.059 (1)
0.0597 (1)
0.064 (1)
0.0713 (1)
0.073 (1)
0.0762 (1)
0.0765 (1)
0.078 (1)
0.094 (1)
- (3)
Reset
Soldering Resistance:JIS C 6471.A (°C)
-
310 (25)
330 (94)
340 (1)
- (1)
Reset
Soldering Resistance:JIS C 6471.C-96/40/90 (°C)
-
250 (38)
260 (56)
270 (1)
290 (25)
- (1)
Reset
MIT Test:JIS C 6471.0.38R×4.9N,MD
-
3 (3)
4 (3)
5 (1)
6 (1)
7 (1)
8 (1)
9 (3)
10 (5)
11 (1)
12 (2)
13 (1)
14 (1)
15 (2)
16 (4)
18 (1)
19 (2)
20 (5)
22 (2)
24 (1)
26 (2)
28 (2)
30 (1)
32 (1)
33 (1)
34 (1)
35 (4)
40 (6)
42 (1)
45 (1)
46 (1)
60 (3)
70 (1)
84 (1)
85 (1)
90 (1)
100 (1)
110 (2)
118 (1)
120 (2)
130 (1)
170 (4)
180 (2)
200 (1)
220 (2)
230 (1)
255 (1)
270 (2)
280 (1)
300 (1)
340 (2)
530 (1)
- (28)
Reset
MIT Test:JIS C 6471.0.38R×4.9N,TD
-
3 (3)
4 (3)
6 (1)
7 (2)
8 (3)
9 (1)
10 (5)
12 (4)
13 (1)
15 (6)
16 (2)
18 (3)
20 (4)
25 (1)
26 (3)
28 (2)
30 (1)
31 (1)
33 (1)
35 (2)
39 (1)
40 (9)
50 (1)
54 (1)
60 (4)
61 (1)
70 (1)
83 (1)
94 (1)
100 (2)
110 (1)
120 (2)
130 (1)
160 (2)
170 (3)
190 (1)
200 (1)
220 (2)
230 (1)
250 (1)
260 (1)
280 (1)
290 (2)
340 (2)
550 (1)
- (28)
Reset
Tensile Modulus:IPC-TM-650 (GPa)
-
4.5 (25)
7.1 (95)
- (1)
Reset
Coefficient of Thermal Expansion.MD:TMA 100℃→250℃,
5℃/min (ppm/K)
-
18 (25)
19.3 (95)
- (1)
Reset
Coefficient of Thermal Expansion.TD:TMA 100℃→250℃,
5℃/min (ppm/K)
-
17.3 (95)
18 (25)
- (1)
Reset
Dielectric Constant at 1MHz:IPC-TM-650 2.5.5.5.A
3.2 (95)
- (26)
Reset
Dielectric Constant at 2GHz:IPC-TM-650 2.5.5.5.A
3.2 (95)
- (26)
Reset
Dielectric Constant at 10GHz:Cavity resonance.A
3.3 (25)
- (96)
Reset
Dissipation Factor at 1MHz:IPC-TM-650 2.5.5.5.A
0.002 (95)
- (26)
Reset
Dissipation Factor at 2GHz:IPC-TM-650 2.5.5.5.A
0.002 (95)
- (26)
Reset
Dissipation Factor at 10GHz:Cavity resonance.A
0.002 (25)
- (96)
Reset
Insulation resistance:JIS C 6471.A (Ω)
>1.0×10^14 (120)
- (1)
Reset
Insulation resistance:JIS C 6471.C-96/40/90 (Ω)
>1.0×10^14 (120)
- (1)
Reset
Water absorption.IPC-TM-650:JIS C 6471.D-24/23 (%)
0.8 (95)
- (26)
Reset
Water absorption:JIS C 6471.D-24/23 (%)
0.04 (25)
- (96)
Reset
Moisture Absorption.IPC-TM-650:C-24/23/50 (%)
0.7 (95)
- (26)
Reset
Tg:DMA.A (°C)
350 (95)
- (26)
Reset
Flammability:UL 94.A+E-168/70
V-0 (79)
VTM-0 (41)
- (1)
Reset
* These are observed data, not guaranteed performance.
The test method of above item is determined according to Panasonic internal standard.
- (121)
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Display items
Series/Type
Copper Foil Type
Copper Foil Part No.
Copper Foil Thickness
Fiim Thickness
Total products thickness
Peel Strength.90°:JIS C 6471.A
Peel Strength.90°:JIS C 6471.260℃ Solder 5sec
Dimensional Stability.MD:IPC-TM-650.After Etching
Dimensional Stability.TD:IPC-TM-650.After Etching
Dimensional Stability.MD:IPC-TM-650.E-0.5/150
Dimensional Stability.TD:IPC-TM-650.E-0.5/150
Soldering Resistance:JIS C 6471.A
Soldering Resistance:JIS C 6471.C-96/40/90
MIT Test:JIS C 6471.0.38R×4.9N,MD
MIT Test:JIS C 6471.0.38R×4.9N,TD
Tensile Modulus:IPC-TM-650
Coefficient of Thermal Expansion.MD:TMA 100℃→250℃, 5℃/min
Coefficient of Thermal Expansion.TD:TMA 100℃→250℃, 5℃/min
Dielectric Constant at 1MHz:IPC-TM-650 2.5.5.5.A
Dielectric Constant at 2GHz:IPC-TM-650 2.5.5.5.A
Dielectric Constant at 10GHz:Cavity resonance.A
Dissipation Factor at 1MHz:IPC-TM-650 2.5.5.5.A
Dissipation Factor at 2GHz:IPC-TM-650 2.5.5.5.A
Dissipation Factor at 10GHz:Cavity resonance.A
Insulation resistance:JIS C 6471.A
Insulation resistance:JIS C 6471.C-96/40/90
Water absorption.IPC-TM-650:JIS C 6471.D-24/23
Water absorption:JIS C 6471.D-24/23
Moisture Absorption.IPC-TM-650:C-24/23/50
Tg:DMA.A
Flammability:UL 94.A+E-168/70
* These are observed data, not guaranteed performance. The test method of above item is determined according to Panasonic internal standard.
Select display items by click or drag-and-drop
Glass transition temp.(Tg) :TMA(Ad)
Glass transition temp.(Tg) :DMA Measurement in tensile mode(Ad)
CTE:α1,X-axis,IPC-TM-650 2.4.24
CTE:α1,Y-axis,IPC-TM-650 2.4.24
CTE:α1,Z-axis,IPC-TM-650 2.4.24
CTE:α2,Z-axis,IPC-TM-650 2.4.24
Volume resistivity:IPC-TM-650 2.5.17.1,C-96/35/90
Dielectric constant(Dk)@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 (Ad)
Dissipation factor(Df )@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 (Ad)
Water absorption:IPC-TM-650 2.6.2.1,D-24/23
Peel strength,1oz:IPC-TM-650 2.4.8
Flammability:UL,A+E-168/70
The sample thickness
*1 Condition: C-96/20/65, Unit : MΩ·m
*2 Condition: E-24/50+D-24/23
*3 Measured by R-FR10/R-F775 25μm/ R-FR10 construction
Choice
Parts no
Catalog /
Datasheet
Series/Type
Copper Foil Type
Copper Foil Part No.
Copper Foil Thickness
(µm)
Fiim Thickness
(µm)
Total products thickness
(µm)
Peel Strength.90°:JIS C 6471.A
(mm)
Peel Strength.90°:JIS C 6471.260℃ Solder 5sec
(mm)
Dimensional Stability.MD:IPC-TM-650.After Etching
(%)
Dimensional Stability.TD:IPC-TM-650.After Etching
(%)
Dimensional Stability.MD:IPC-TM-650.E-0.5/150
(%)
Dimensional Stability.TD:IPC-TM-650.E-0.5/150
(%)
Soldering Resistance:JIS C 6471.A
(°C)
Soldering Resistance:JIS C 6471.C-96/40/90
(°C)
MIT Test:JIS C 6471.0.38R×4.9N,MD
MIT Test:JIS C 6471.0.38R×4.9N,TD
Tensile Modulus:IPC-TM-650
(GPa)
Coefficient of Thermal Expansion.MD:TMA 100℃→250℃,
5℃/min
(ppm/K)
Coefficient of Thermal Expansion.TD:TMA 100℃→250℃,
5℃/min
(ppm/K)
Dielectric Constant at 1MHz:IPC-TM-650 2.5.5.5.A
Dielectric Constant at 2GHz:IPC-TM-650 2.5.5.5.A
Dielectric Constant at 10GHz:Cavity resonance.A
Dissipation Factor at 1MHz:IPC-TM-650 2.5.5.5.A
Dissipation Factor at 2GHz:IPC-TM-650 2.5.5.5.A
Dissipation Factor at 10GHz:Cavity resonance.A
Insulation resistance:JIS C 6471.A
(Ω)
Insulation resistance:JIS C 6471.C-96/40/90
(Ω)
Water absorption.IPC-TM-650:JIS C 6471.D-24/23
(%)
Water absorption:JIS C 6471.D-24/23
(%)
Moisture Absorption.IPC-TM-650:C-24/23/50
(%)
Tg:DMA.A
(°C)
Flammability:UL 94.A+E-168/70
* These are observed data, not guaranteed performance.
The test method of above item is determined according to Panasonic internal standard.
Glass transition temp.(Tg) :TMA(Ad)
(°C)
Glass transition temp.(Tg) :DMA
Measurement in tensile mode(Ad)
(°C)
CTE:α1,X-axis,IPC-TM-650 2.4.24
(ppm/°C)
CTE:α1,Y-axis,IPC-TM-650 2.4.24
(ppm/°C)
CTE:α1,Z-axis,IPC-TM-650 2.4.24
(ppm/°C)
CTE:α2,Z-axis,IPC-TM-650 2.4.24
(ppm/°C)
Volume resistivity:IPC-TM-650 2.5.17.1,C-96/35/90
(MΩ·cm)
Dielectric constant(Dk)@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 (Ad)
Dissipation factor(Df )@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 (Ad)
Water absorption:IPC-TM-650 2.6.2.1,D-24/23
(%)
Peel strength,1oz:IPC-TM-650 2.4.8
(kN/m (lb/inch))
Flammability:UL,A+E-168/70
The sample thickness
*1 Condition: C-96/20/65, Unit : MΩ·m
*2 Condition: E-24/50+D-24/23
*3 Measured by R-FR10/R-F775 25μm/ R-FR10 construction
R-F700S_12EC_18-25-0(ED)
R-F700S (LCP* Single-sided copper clad)
ED
TP4-S
18
25
43
0.8
0.8
0.058
0.021
0.092
0.064
310
290
255
250
4.5
18
18
-
-
3.3
-
-
0.002
>1.0×10^14
>1.0×10^14
-
0.04
-
-
VTM-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F700S_13EC_12-25-0(ED)
R-F700S (LCP* Single-sided copper clad)
ED
TP4-S
12
25
37
0.75
0.75
0.036
0.01
0.082
-0.041
310
290
300
280
4.5
18
18
-
-
3.3
-
-
0.002
>1.0×10^14
>1.0×10^14
-
0.04
-
-
VTM-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F700S_22EC_18-50-0(ED)
R-F700S (LCP* Single-sided copper clad)
ED
TP4-S
18
50
68
0.8
0.8
0.064
0.029
0.108
0.073
310
290
118
83
4.5
18
18
-
-
3.3
-
-
0.002
>1.0×10^14
>1.0×10^14
-
0.04
-
-
VTM-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F700S_23EC_12-50-0(ED)
R-F700S (LCP* Single-sided copper clad)
ED
TP4-S
12
50
62
0.75
0.75
0.04
-0.039
0.089
-0.039
310
290
84
61
4.5
18
18
-
-
3.3
-
-
0.002
>1.0×10^14
>1.0×10^14
-
0.04
-
-
VTM-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F700S_32EC_18-75-0(ED)
R-F700S (LCP* Single-sided copper clad)
ED
TP4-S
18
75
93
0.8
0.8
0.0265
0.0167
0.0717
0.0582
310
290
28
18
4.5
18
18
-
-
3.3
-
-
0.002
>1.0×10^14
>1.0×10^14
-
0.04
-
-
VTM-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F700S_33EC_12-75-0(ED)
R-F700S (LCP* Single-sided copper clad)
ED
TP4-S
12
75
87
0.75
0.75
0.033
0.002
0.072
0.017
310
290
28
18
4.5
18
18
-
-
3.3
-
-
0.002
>1.0×10^14
>1.0×10^14
-
0.04
-
-
VTM-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F700S_43EC_12-100-0(ED)
R-F700S (LCP* Single-sided copper clad)
ED
TP4-S
12
100
112
0.75
0.75
-0.018
-0.036
0.009
-0.029
310
290
10
8
4.5
18
18
-
-
3.3
-
-
0.002
>1.0×10^14
>1.0×10^14
-
0.04
-
-
VTM-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F700S_A3EC_12-125-0(ED)
R-F700S (LCP* Single-sided copper clad)
ED
TP4-S
12
125
137
0.75
0.75
0.0278
0.0156
0.077
0.0375
310
290
4
4
4.5
18
18
-
-
3.3
-
-
0.002
>1.0×10^14
>1.0×10^14
-
0.04
-
-
VTM-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F700S_B3EC_12-150-0(ED)
R-F700S (LCP* Single-sided copper clad)
ED
TP4-S
12
150
162
0.75
0.75
0.0424
0.0285
0.0973
0.0713
310
290
3
3
4.5
18
18
-
-
3.3
-
-
0.002
>1.0×10^14
>1.0×10^14
-
0.04
-
-
VTM-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F705S_12EC_18-25-18(ED)
R-F705S (LCP* Double-sided copper clad)
ED
TP4-S
18
25
61
0.8
0.8
0.024
-0.006
0.07
0.015
310
290
220
190
4.5
18
18
-
-
3.3
-
-
0.002
>1.0×10^14
>1.0×10^14
-
0.04
-
-
VTM-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F705S_13EC_12-25-12(ED)
R-F705S (LCP* Double-sided copper clad)
ED
TP4-S
12
25
49
0.75
0.75
0.019
-0.021
0.054
-0.01
310
290
280
290
4.5
18
18
-
-
3.3
-
-
0.002
>1.0×10^14
>1.0×10^14
-
0.04
-
-
VTM-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F705S_14EC_9-25-9(ED)
R-F705S (LCP* Double-sided copper clad)
ED
TP4-S
9
25
43
0.65
0.65
0.032
0.001
0.088
0.036
310
290
70
60
4.5
18
18
-
-
3.3
-
-
0.002
>1.0×10^14
>1.0×10^14
-
0.04
-
-
VTM-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F705S_22EC_18-50-18(ED)
R-F705S (LCP* Double-sided copper clad)
ED
TP4-S
18
50
86
0.8
0.8
0.016
-0.038
0.05
-0.035
310
290
110
100
4.5
18
18
-
-
3.3
-
-
0.002
>1.0×10^14
>1.0×10^14
-
0.04
-
-
VTM-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F705S_23EC_12-50-12(ED)
R-F705S (LCP* Double-sided copper clad)
ED
TP4-S
12
50
74
0.75
0.75
-0.004
-0.058
-0.002
-0.073
310
290
85
70
4.5
18
18
-
-
3.3
-
-
0.002
>1.0×10^14
>1.0×10^14
-
0.04
-
-
VTM-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F705S_24EC_9-50-9(ED)
R-F705S (LCP* Double-sided copper clad)
ED
TP4-S
9
50
68
0.8
0.8
0.007
-0.053
0.04
-0.056
310
290
60
50
4.5
18
18
-
-
3.3
-
-
0.002
>1.0×10^14
>1.0×10^14
-
0.04
-
-
VTM-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F705S_32EC_18-75-18(ED)
R-F705S (LCP* Double-sided copper clad)
ED
TP4-S
18
75
111
0.8
0.8
0.064
0.042
0.121
0.094
310
290
32
28
4.5
18
18
-
-
3.3
-
-
0.002
>1.0×10^14
>1.0×10^14
-
0.04
-
-
VTM-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F705S_33EC_12-75-12(ED)
R-F705S (LCP* Double-sided copper clad)
ED
TP4-S
12
75
99
0.75
0.75
0.021
0.006
0.028
0.004
310
290
22
16
4.5
18
18
-
-
3.3
-
-
0.002
>1.0×10^14
>1.0×10^14
-
0.04
-
-
VTM-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F705S_34EC_9-75-9(ED)
R-F705S (LCP* Double-sided copper clad)
ED
TP4-S
9
75
93
0.65
0.65
-0.003
0.017
0.045
0.054
310
290
20
15
4.5
18
18
-
-
3.3
-
-
0.002
>1.0×10^14
>1.0×10^14
-
0.04
-
-
VTM-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F705S_42EC_18-100-18(ED
R-F705S (LCP* Double-sided copper clad)
ED
TP4-S
18
100
136
0.8
0.8
0.007
-0.002
0.034
0.021
310
290
16
12
4.5
18
18
-
-
3.3
-
-
0.002
>1.0×10^14
>1.0×10^14
-
0.04
-
-
VTM-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F705S_43EC_12-100-12(ED
R-F705S (LCP* Double-sided copper clad)
ED
TP4-S
12
100
124
0.75
0.75
-0.016
-0.049
0.009
-0.052
310
290
11
8
4.5
18
18
-
-
3.3
-
-
0.002
>1.0×10^14
>1.0×10^14
-
0.04
-
-
VTM-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F705S_44EC_9-100-9(ED)
R-F705S (LCP* Double-sided copper clad)
ED
TP4-S
9
100
118
0.65
0.65
0.021
0.02
0.06
0.044
310
290
8
8
4.5
18
18
-
-
3.3
-
-
0.002
>1.0×10^14
>1.0×10^14
-
0.04
-
-
VTM-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F705S_A2EC_18-125-18(ED
R-F705S (LCP* Double-sided copper clad)
ED
TP4-S
18
125
161
0.75
0.75
0.0463
0.0354
0.0996
0.0765
310
290
6
6
4.5
18
18
-
-
3.3
-
-
0.002
>1.0×10^14
>1.0×10^14
-
0.04
-
-
VTM-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F705S_A3EC_12-125-12(ED
R-F705S (LCP* Double-sided copper clad)
ED
TP4-S
12
125
149
0.75
0.75
0.02
-0.005
0.067
0.035
310
290
4
4
4.5
18
18
-
-
3.3
-
-
0.002
>1.0×10^14
>1.0×10^14
-
0.04
-
-
VTM-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F705S_B2EC_18-150-18(ED
R-F705S (LCP* Double-sided copper clad)
ED
TP4-S
18
150
186
0.75
0.75
0.023
0.028
0.067
0.078
310
290
3
3
4.5
18
18
-
-
3.3
-
-
0.002
>1.0×10^14
>1.0×10^14
-
0.04
-
-
VTM-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F705S_B3EC_12-150-12(ED
R-F705S (LCP* Double-sided copper clad)
ED
TP4-S
12
150
174
0.75
0.75
0.0301
0.0102
0.0821
0.0762
310
290
3
3
4.5
18
18
-
-
3.3
-
-
0.002
>1.0×10^14
>1.0×10^14
-
0.04
-
-
VTM-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_10RB_70-25-0(RA)
R-F770 (Single-sided copper clad)
RA
BHY
70
25
95
2.5
2.5
-0.0277
0.0247
-0.0597
-0.003
330
260
33
40
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_11RB_35-25-0(RA)
R-F770 (Single-sided copper clad)
RA
BHY
35
25
60
1.6
1.6
0.006
-0.007
-0.036
-0.056
330
260
90
130
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_12EV_18-25-0(ED)
R-F770 (Single-sided copper clad)
ED
VLP
18
25
43
1.5
1.5
-0.0078
0.024
-0.0378
0.0021
330
260
180
170
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_12RB_18-25-0(RA)
R-F770 (Single-sided copper clad)
RA
BHY
18
25
43
1.5
1.5
-0.014
-0.013
-0.055
-0.057
330
260
180
200
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_13EV_12-25-0(ED)
R-F770 (Single-sided copper clad)
ED
VLP
12
25
37
1.5
1.5
0.019
0.008
0.009
0.001
330
260
230
220
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_13RX_12-25-0(RA)
R-F770 (Single-sided copper clad)
RA
BHYX-T
12
25
37
1.5
1.5
-0.002
0.025
-0.02
-0.011
330
260
270
290
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_14EV_9-25-0(ED)
R-F770 (Single-sided copper clad)
ED
VLP
9
25
34
1.3
1.3
-0.003
0.023
-0.026
0.003
330
260
130
94
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_14RN_9-25-0(RA)
R-F770 (Single-sided copper clad)
RA
BHY-HA-V2
9
25
34
1.3
1.3
-0.0127
-0.0022
-0.0425
-0.0255
330
260
340
340
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_16ES_6-25-0(ED)
R-F770 (Single-sided copper clad)
ED
SEED
6
25
31
1
1
-0.0258
-0.0103
-0.0579
-0.0345
330
260
-
-
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_1PEL_2-25-0(ED)
R-F770 (Single-sided copper clad)
ED
MT18FL
2
25
27
1.3
1.3
-0.0356
-0.0037
-0.0497
-0.0215
330
260
120
120
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_21RB_35-50-0(RA)
R-F770 (Single-sided copper clad)
RA
BHY
35
50
85
2.5
2.5
0.009
0.013
-0.0175
-0.0438
330
260
42
54
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_22EV_18-50-0(ED)
R-F770 (Single-sided copper clad)
ED
VLP
18
50
68
1.7
1.7
0.009
0.02
0.0082
0.013
330
260
35
35
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_22RB_18-50-0(RA)
R-F770 (Single-sided copper clad)
RA
BHY
18
50
68
1.5
1.5
-0.004
-0.01
-0.047
-0.046
330
260
60
60
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_23EV_12-50-0(ED)
R-F770 (Single-sided copper clad)
ED
VLP
12
50
62
1.6
1.6
0.011
0.009
-0.001
-0.009
330
260
40
40
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_23RX_12-50-0(RA)
R-F770 (Single-sided copper clad)
RA
BHYX-T
12
50
62
1.5
1.5
-0.002
0.038
-0.031
0.001
330
260
40
40
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_26ES_6-50-0(ED)
R-F770 (Single-sided copper clad)
ED
SEED
6
50
56
1
1
0.00050
0.0171
-0.0377
-0.0158
330
260
40
40
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_27RN_105-50-0(RA)
R-F770 (Single-sided copper clad)
RA
BHY
105
50
155
3
3
-0.0154
-0.0278
-0.0621
-0.0807
330
260
24
28
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_30RB_70-75-0(RA)
R-F770 (Single-sided copper clad)
RA
BHY
70
75
145
2.5
2.5
-0.0185
-0.00050
-0.0688
-0.0459
330
250
19
20
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_32EV_18-75-0(ED)
R-F770 (Single-sided copper clad)
ED
VLP
18
75
73
1.5
1.5
-0.008
-0.0058
-0.0304
-0.0328
330
250
15
18
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_33EV_12-75-0(ED)
R-F770 (Single-sided copper clad)
ED
VLP
12
75
87
1.5
1.5
-0.003
-0.0015
-0.0333
-0.0337
330
250
16
15
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_33RX_12-75-0(RA)
R-F770 (Single-sided copper clad)
RA
BHYX-T
12
75
87
1.5
1.5
0.0102
0.0175
-0.0334
-0.0242
330
250
22
33
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_41EM_35-100-0(ED)
R-F770 (Single-sided copper clad)
ED
T4M-HDR
35
100
135
3
3
-0.0218
-0.0222
-0.056
-0.0556
330
250
12
12
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_42EV_18-100-0(ED)
R-F770 (Single-sided copper clad)
ED
VLP
18
100
118
2.6
2.6
-0.0088
-0.0085
-0.0381
-0.038
330
250
7
9
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_42RB_18-100-0(RA)
R-F770 (Single-sided copper clad)
RA
BHY
18
100
118
2
2
-0.006
-0.0063
-0.0283
-0.0251
330
250
14
13
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_43EV_12-100-0(ED)
R-F770 (Single-sided copper clad)
ED
VLP
12
100
112
2.4
2.4
-0.012
-0.014
-0.029
-0.03
330
250
10
10
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-