- Good secondary lamination molding processability, excellent adhesion between the layers
- High-speed drilling processing with less resin smear is possible
- Excellent electrical and mechanical properties
Circuit Board Materials
- Part Number
Laminate R-1766
Prepreg R-1661
- Application
- Detailed use
・For automotive components, etc
Properties
Excellent multilayer lamination
Excellent workability
Dimensional stability
General properties
| Item | Test method | Condition | Unit | Multi-layer R-1766 |
|
|---|---|---|---|---|---|
| Glass transition temp (Tg) | DSC | A | °C | 140 | |
| Thermal decomposition (Td) | TG/DTA | A | °C | 315 | |
| CTE x-axis | α1 | IPC TM-650 2.4.41 | A | ppm/°C | 11-13 |
| CTE y-axis | 13-15 | ||||
| CTE z-axis | α1 | IPC TM-650 2.4.24 | A | 65 | |
| α2 | 270 | ||||
| Dielectric constant (Dk) | 1GHz | IPC TM-650 2.5.5.9 | C-24/23/50 | – | 4.3 |
| Dissipation factor (Df) | 0.016 | ||||
| Water absorption | IPC TM-650 2.6.2.1 | D-24/23 | % | 0.14 | |
| Peel strength | 1oz | IPC TM-650 2.4.8 | A | kN/m | 2.0 |
The sample thickness is 0.8mm.
The above data are typical values and not guaranteed values.
