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R-G535E : IC Substrate Materials "LEXCM GX" series

Product
IC Substrate Materials "LEXCM GX" series

Series/Type
High modulus Low CTE IC substrate materials

Parts no
R-G535E

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Photo:R-G535E
Item Performance characteristics
Glass transition temp.(Tg) :DSC -
Glass transition temp.(Tg) :TMA (°C) 210
Glass transition temp.(Tg) :TMA
Measurement in tensile mode (°C)		 -
Glass transition temp.(Tg) :DMA (°C) 260
Glass transition temp.(Tg) :DMA
Measurement in tensile mode (°C)		 -
Thermal decomposition temp.(Td):TGA (°C) 365
Time to delam(T288)Without Cu:IPC-TM-650 2.4.24.1 (min) -
Time to delam(T288)With Cu:IPC-TM-650 2.4.24.1 (min) -
CTE:α1,X-axis,IPC-TM-650 2.4.24 (ppm/°C) 7-8
CTE:α1,Y-axis,IPC-TM-650 2.4.24 (ppm/°C) 7-8
CTE:α1,Z-axis,IPC-TM-650 2.4.24 (ppm/°C) 20
CTE:α2,Z-axis,IPC-TM-650 2.4.24 (ppm/°C) 100
Thermal conductivity:Laser flash,25˚C (W/m·K) 0.55
Volume resistivity:IPC-TM-650 2.5.17.1,C-96/35/90 (MΩ·cm) 1 x 10⁸
Surface resistivity:IPC-TM-650 2.5.17.1,C-96/35/90 (MΩ) 1 x 10⁸
Dielectric constant(Dk)@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 4.6
Dielectric constant(Dk)@10GHz:IPC-TM-650 2.5.5.5,C-24/23/50 -
Dielectric constant(Dk)@12GHz:Balanced-type circular disk resonator,C-24/23/50 -
Dissipation factor(Df )@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 0.015
Dissipation factor(Df )@10GHz:IPC-TM-650 2.5.5.5,C-24/23/50 -
Dissipation factor(Df )@12GHz:Balanced-type circular disk resonator,C-24/23/50 -
Water absorption:IPC-TM-650 2.6.2.1,D-24/23 (%) 0.15-0.20
Flexural modulus,Warp/MD:JIS C 6481 (GPa) 29
Flexural modulus,Fill/TD:JIS C 6481 (GPa) 28
Peel strength,1oz:IPC-TM-650 2.4.8 (kN/m (lb/inch)) 0.6(3.4)
(12μm)
Flammability:UL,C-48/23/50 -
The sample thickness The sample thickness is depending on the test method.
The above data are typical values and not guaranteed values. -
*1 Test method: TMA -