For power modules high thermal conductive semiconductor encapsulation materials | CV4180, CV4380

For power modules high thermal conductive semiconductor encapsulation materials

 

  1. Achieving high mountability and high heat dissipation → Package warpage control
  2. Suitable for large packages with heat spreaders exposed → T/C resistance improvement due to stress reduction
  3. Compatible with nickel plating → Achieved high adhesion

Product features

For power modules high thermal conductive semiconductor encapsulation materials

ECOM E
  • CV4180 CV4380

For IC package

Inverter module for major appliances and industrial motors, Automotive module

Stress reduction:Thermal cycle(T/C) resistance

Stress reduction:Thermal cycle(T/C) resistance

Nickel plating adhesion:Shear adhesive strength

Nickel plating adhesion:Shear adhesive strength

Line-up

Part Number Applications Features
CV3300 / CV4380 Encapsulation of fully-molded module High thermal conductive grade(1.7∼2.3 W/mK)
CV4500 / CV4580 Super high thermal conductive grade(3.0∼3.5 W/mK)
CV4100A/CV4180A Encapsulation of module with heat spreader exposed Low stress type for metallic substrates
CV4100B/CV4180B Low stress type for ceramic substrates

The above data is actual values and not guaranteed values.

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