R-F775_B2RB_18-150-18(RA) : 移动设备用 柔性基板材料「FELIOS」系列

产品名

移动设备用柔性基板材料「FELIOS」系列

系列/类型

R-F775 (Double-sided copper clad)

型号

R-F775_B2RB_18-150-18(RA)

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特性值

项目	内容
Glass transition temp.(Tg) :TMA(Ad) (°C)	-
Glass transition temp.(Tg) :DMA Measurement in tensile mode(Ad) (°C)	-
CTE:α1,X-axis,IPC-TM-650 2.4.24 (ppm/°C)	-
CTE:α1,Y-axis,IPC-TM-650 2.4.24 (ppm/°C)	-
CTE:α1,Z-axis,IPC-TM-650 2.4.24 (ppm/°C)	-
CTE:α2,Z-axis,IPC-TM-650 2.4.24 (ppm/°C)	-
Volume resistivity:IPC-TM-650 2.5.17.1,C-96/35/90 (MΩ·cm)	-
Dielectric constant(Dk)@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 (Ad)	-
Dissipation factor(Df )@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 (Ad)	-
Water absorption:IPC-TM-650 2.6.2.1,D-24/23 (%)	-
Peel strength,1oz:IPC-TM-650 2.4.8 (kN/m (lb/inch))	-
Flammability:UL,A+E-168/70	-
The sample thickness	-
*1 Condition: C-96/20/65, Unit : MΩ·m	-
*2 Condition: E-24/50+D-24/23	-
*3 Measured by R-FR10/R-F775 25μm/ R-FR10 construction	-
Copper Foil Type	RA
Copper Foil Part No.	BHY
Copper Foil Thickness (µm)	18
Fiim Thickness (µm)	150
Total products thickness (µm)	186
Peel Strength.90°:JIS C 6471.A (mm)	1.6
Peel Strength.90°:JIS C 6471.260℃ Solder 5sec (mm)	1.6
Dimensional Stability.MD:IPC-TM-650.After Etching (%)	-0.023
Dimensional Stability.TD:IPC-TM-650.After Etching (%)	-0.025
Dimensional Stability.MD:IPC-TM-650.Ｅ-0.5/150 (%)	-0.081
Dimensional Stability.TD:IPC-TM-650.Ｅ-0.5/150 (%)	-0.062
Soldering Resistance:JIS C 6471.A (°C)	330
Soldering Resistance:JIS C 6471.C-96/40/90 (°C)	250
MIT Test:JIS C 6471.0.38R×4.9N,MD	-
MIT Test:JIS C 6471.0.38R×4.9N,TD	-
Tensile　Modulus:IPC-TM-650 (GPa)	7.1
Coefficient of Thermal Expansion.MD:TMA　100℃→250℃， 5℃/min (ppm/K)	19.3
Coefficient of Thermal Expansion.TD:TMA　100℃→250℃， 5℃/min (ppm/K)	17.3
Dielectric Constant at 1MHz:IPC-TM-650　2.5.5.5.A	3.2
Dielectric Constant at 2GHz:IPC-TM-650　2.5.5.5.A	3.2
Dielectric Constant at 10GHz:Cavity resonance.A	-
Dissipation Factor at 1MHz:IPC-TM-650　2.5.5.5.A	0.002
Dissipation Factor at 2GHz:IPC-TM-650　2.5.5.5.A	0.002
Dissipation Factor at 10GHz:Cavity resonance.A	-
Insulation resistance:JIS C 6471.A (Ω)	＞1.0×10^14
Insulation resistance:JIS C 6471.C-96/40/90 (Ω)	＞1.0×10^14
Water absorption.IPC-TM-650:JIS C 6471.D-24/23 (%)	0.8
Water absorption:JIS C 6471.D-24/23 (%)	-
Moisture Absorption.IPC-TM-650:C-24/23/50 (%)	0.7
Tg:DMA.A (°C)	350
Flammability:UL 94.A+E-168/70	V-0
* These are observed data, not guaranteed performance. The test method of above item is determined according to Panasonic internal standard.	-