R-3566D/R-3551D : 无卤环氧玻璃多层基板材料「Halogen-free」系列

产品名

无卤环氧玻璃多层基板材料「Halogen-free」系列

系列/类型

High CTI, High RTI Halogen-free multi-layer circuit board materials

型号

R-3566D/R-3551D

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资料

请事先务必阅读注意事项

特性值

项目	内容
Glass transition temp.(Tg) :DSC (°C)	175
Glass transition temp.(Tg) :TMA (°C)	170
Glass transition temp.(Tg) :DMA (°C)	-
Thermal decomposition temp.(Td):TGA (°C)	355
Time to delam(T288)Without Cu:IPC-TM-650 2.4.24.1 (min)	-
Time to delam(T288)With Cu:IPC-TM-650 2.4.24.1 (min)	-
CTE:α1,X-axis,IPC-TM-650 2.4.24 (ppm/°C)	-
CTE:α1,Y-axis,IPC-TM-650 2.4.24 (ppm/°C)	-
CTE:α1,Z-axis,IPC-TM-650 2.4.24 (ppm/°C)	40
CTE:α2,Z-axis,IPC-TM-650 2.4.24 (ppm/°C)	180
Thermal conductivity:Laser flash,25˚C (W/m·K)	-
Volume resistivity:IPC-TM-650 2.5.17.1,C-96/35/90 (MΩ·cm)	-
Surface resistivity:IPC-TM-650 2.5.17.1,C-96/35/90 (MΩ)	-
Dielectric constant(Dk)@1MHz:IPC-TM-650 2.5.5.9,C-24/23/50	-
Dielectric constant(Dk)@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50	-
Dielectric constant(Dk)@10GHz:IPC-TM-650 2.5.5.5,C-24/23/50	-
Dielectric constant(Dk)@12GHz:Balanced-type circular disk resonator,C-24/23/50	-
Dissipation factor(Df )@1MHz:IPC-TM-650 2.5.5.9,C-24/23/50	-
Dissipation factor(Df )@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50	-
Dissipation factor(Df )@10GHz:IPC-TM-650 2.5.5.5,C-24/23/50	-
Dissipation factor(Df )@12GHz:Balanced-type circular disk resonator,C-24/23/50	-
Water absorption:IPC-TM-650 2.6.2.1,D-24/23 (%)	-
Flexural modulus,Warp/MD:JIS C 6481 (GPa)	-
Flexural modulus,Fill/TD:JIS C 6481 (GPa)	-
Peel strength,1oz:IPC-TM-650 2.4.8 (kN/m (lb/inch))	1.6
Flammability:UL,C-48/23/50	94V-0
The sample thickness	0.8mm
The above data are typical values and not guaranteed values.	-
*1 Test method: TMA	-

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文档

[目录/资料]

Catalog_3566D_en.pdf(246KB)

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