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R-1755E : 车载设备用 多层基板材料「HIPER」系列

产品名
车载设备用 多层基板材料「HIPER」系列

系列/类型
HIPER E High heat resistance multi-layer circuit board materials HIPER E

型号
R-1755E

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一张照片：R-1755E
项目 内容
Glass transition temp.(Tg) :DSC (°C) 133
Glass transition temp.(Tg) :TMA (°C) 133
Glass transition temp.(Tg) :DMA (°C) 153
Thermal decomposition temp.(Td):TGA (°C) 370
Time to delam(T288)Without Cu:IPC-TM-650 2.4.24.1 (min) >120
Time to delam(T288)With Cu:IPC-TM-650 2.4.24.1 (min) 25
CTE:α1,X-axis,IPC-TM-650 2.4.24 (ppm/°C) 11-13
CTE:α1,Y-axis,IPC-TM-650 2.4.24 (ppm/°C) 13-15
CTE:α1,Z-axis,IPC-TM-650 2.4.24 (ppm/°C) 42
CTE:α2,Z-axis,IPC-TM-650 2.4.24 (ppm/°C) 250
Thermal conductivity:Laser flash,25˚C -
Volume resistivity:IPC-TM-650 2.5.17.1,C-96/35/90 (MΩ·cm) 1 x 109
Surface resistivity:IPC-TM-650 2.5.17.1,C-96/35/90 (MΩ) 1 x 108
Dielectric constant(Dk)@1MHz:IPC-TM-650 2.5.5.9,C-24/23/50 5
Dielectric constant(Dk)@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 4.6
Dielectric constant(Dk)@10GHz:IPC-TM-650 2.5.5.5,C-24/23/50 -
Dielectric constant(Dk)@12GHz:Balanced-type circular disk resonator,C-24/23/50 -
Dissipation factor(Df )@1MHz:IPC-TM-650 2.5.5.9,C-24/23/50 0.013
Dissipation factor(Df )@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 0.013
Dissipation factor(Df )@10GHz:IPC-TM-650 2.5.5.5,C-24/23/50 -
Dissipation factor(Df )@12GHz:Balanced-type circular disk resonator,C-24/23/50 -
Water absorption:IPC-TM-650 2.6.2.1,D-24/23 (%) 0.11
Flexural modulus,Warp/MD:JIS C 6481 -
Flexural modulus,Fill/TD:JIS C 6481 (GPa) 22
Peel strength,1oz:IPC-TM-650 2.4.8 (kN/m (lb/inch)) 1.6
Flammability:UL,C-48/23/50 94V-0
The sample thickness 0.8mm
The above data are typical values and not guaranteed values. -
*1 Test method: TMA -