R-5725/R-5620 : ICT基础设备用 多层基板材料「MEGTRON」系列

产品名

ICT基础设备用多层基板材料「MEGTRON」系列

系列/类型

MEGTRON4S, MEGTRON4 Low transmission loss Highly heat resistant Multi-layer circuit board materials

型号

R-5725/R-5620

放大

特性值

项目	内容
Glass transition temp.(Tg) :DSC (°C)	176
Glass transition temp.(Tg) :TMA (°C)	170
Glass transition temp.(Tg) :DMA (°C)	210
Thermal decomposition temp.(Td):TGA (°C)	360
Time to delam(T288)Without Cu:IPC-TM-650 2.4.24.1 (min)	>120
Time to delam(T288)With Cu:IPC-TM-650 2.4.24.1 (min)	30
CTE:α1,X-axis,IPC-TM-650 2.4.24 (ppm/°C)	12-14
CTE:α1,Y-axis,IPC-TM-650 2.4.24 (ppm/°C)	13-15
CTE:α1,Z-axis,IPC-TM-650 2.4.24 (ppm/°C)	35
CTE:α2,Z-axis,IPC-TM-650 2.4.24 (ppm/°C)	265
Thermal conductivity:Laser flash,25˚C (W/m·K)	0.6
Volume resistivity:IPC-TM-650 2.5.17.1,C-96/35/90 (MΩ·cm)	1 x 10⁹
Surface resistivity:IPC-TM-650 2.5.17.1,C-96/35/90 (MΩ)	1 x 10⁸
Dielectric constant(Dk)@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50	3.8
Dielectric constant(Dk)@10GHz:IPC-TM-650 2.5.5.5,C-24/23/50	-
Dielectric constant(Dk)@12GHz:Balanced-type circular disk resonator,C-24/23/50	3.8
Dielectric constant(Dk)@14GHz:Balanced-type circular disk resonator,C-24/23/50	-
Dissipation factor(Df )@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50	0.005
Dissipation factor(Df )@10GHz:IPC-TM-650 2.5.5.5,C-24/23/50	0.007
Dissipation factor(Df )@12GHz:Balanced-type circular disk resonator,C-24/23/50	-
Dissipation factor(Df)@14GHz:Balanced-type circular disk resonator,C-24/23/50	-
Water absorption:IPC-TM-650 2.6.2.1,D-24/23 (%)	0.14
Flexural modulus,Warp/MD:JIS C 6481 (GPa)	25
Flexural modulus,Fill/TD:JIS C 6481 (GPa)	23
Peel strength,1oz:IPC-TM-650 2.4.8 (kN/m (lb/inch))	1.1(6.3) (Cu:RT)
Peel Strength,1oz(H-VLP3):IPC-TM-650 2.4.8 (kN/m)	-
Flammability:UL,C-48/23/50	94V-0
The sample thickness	0.8mm
The above data are typical values and not guaranteed values.	-
*1 Test method: TMA	-