In the industrial component field where progress is being made to increase functionality, Panasonic provides devices best suited to customer's needs.
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Capacitors
- Conductive Polymer Aluminum Electrolytic Capacitors (SP-Cap)
- Conductive Polymer Tantalum Solid Capacitors (POSCAP)
- Conductive Polymer Aluminum Solid Capacitors (OS-CON)
- Conductive Polymer Hybrid Aluminum Electrolytic Capacitors
- Film Capacitors (Electronic Equipment Use)
- Film Capacitors (Automotive, Industrial and Infrastructure Use)
Resistors
Inductors
Thermal Management Solutions
EMC Components
Circuit Protection
Relays
Motor
Batteries (for Business)
Materials
Electronic Materials
- Halogen-free Multi-layer circuit board materials
- Capillary Underfill(CUF) Semiconductor encapsulation materials
- Thin surface mounting semiconductor encapsulation materials
- For SMD module low warpage liquid encapsulant
- High elasticity Low CTE IC substrate materials
- Low CTE IC substrate materials
- High elasticity Low CTE Ultra-thin IC substrate materials
- High heat resistance Secondary mounting Sidefill materials
- High heat resistance Secondary mounting Underfill materials
- Low-temperature curing Secondary mounting Underfill materials
- For secondary mounting reinforcement drop impact resistance liquid encapsulant
- For power modules high thermal conductive semiconductor encapsulation materials
- For high heat resistance power devices semiconductor encapsulation materials