Sitemap
- Products
- Capacitors
- Resistors
- Inductors (Coils)
- Thermal Management Solutions
- EMC Components, Circuit Protection
- Sensors
- Input Devices, Switches
- Relays, Connectors
- FA Sensors & Components
- Motors, Compressors
- Custom & Module Devices
- Factory Automation, Welding Machines
- Batteries (for Business)
- Electronic Materials
- Circuit Board Materials
- Multi-layer Circuit Board Materials for ICT infrastructure equipment "MEGTRON" series
- High frequency circuit board materials for wireless/RF applications "XPEDION"series
- Multi-layer Circuit Board Materials for Automotive Components "HIPER" series
- Circuit Board Materials for LED lightings "ECOOL" series
- Flexible Circuit Board Materials for Mobile Products "FELIOS" series
- Halogen-free Glass Epoxy Multi-layer Circuit Board Materials "Halogen-free" series
- Glass Epoxy Circuit Board Materials
- Mass laminations(Shield board) "PreMulti"
- Glass Composite Circuit Board Materials
- Paper Phenolic Circuit Board Materials
- Semiconductor Device Materials
- IC Substrate Materials "LEXCM GX" series
- Semiconductor Packaging Encapsulation Materials for Advanced Package "LEXCM CF", "LEXCM DF" series
- Semiconductor Packaging Encapsulation Materials for Automotive/Industrial equipment "LEXCM CF" series
- Liquid Materials for Board level Underfill, Adhesives "LEXCM DF" series
- Plastic Molding Compound
- Advanced Films
- Other New Materials
- Circuit Board Materials
- Materials