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Secondary mounting reinforcement of semiconductor package
such as CSP/BGA, Adhesive bonding of camera module/image sensor
such as CSP/BGA, Adhesive bonding of camera module/image sensor
Semiconductor Encapsulation Materials
- High heat resistance Secondary mounting Sidefill materials
CV5797 - High heat resistance Secondary mounting Underfill materials
CV5794 - Low-temperature curing Secondary mounting Underfill materials
CV5350AS
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| Application | Our proposal |
|---|---|
| CSP / BGA / Image Sensor WLPCSP / QFN / MLCC, etc  |
High heat resistance Secondary mounting Sidefill materials For large size PKG Pot life 72h Easy to inspect |
|
High heat resistance Secondary mounting Underfill materials For PKG under 20mm square Pot life 72h |
|
|
Low-temperature curing Secondary mounting Underfill materials High fluidity |
Surface Mount Assembly Reinforcement Type for PKGs
Necessity of Reinforcement for Automotive Electronic Components (Solder Crack Causes)
