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ICTインフラ機器用 多層基板材料「MEGTRON」シリーズ : 品番

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データシート		 シリーズ／タイプ ガラス転移温度(Tg):DSC
(°C) 		ガラス転移温度(Tg):TMA
(°C) 		ガラス転移温度(Tg):DMA
(°C) 		熱分解温度(Td):TGA
(°C) 		比誘電率(Dk))@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 比誘電率(Dk)@10GHz:IPC-TM-650 2.5.5.5,C-24/23/50 比誘電率(Dk)@12GHz:平衡型円板
共振器法,C-24/23/50 		比誘電率(Dk)@14GHz:平衡型円板
共振器法,C-24/23/50 		誘電正接(Df)@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 誘電正接(Df)@10GHz:IPC-TM-650 2.5.5.5,C-24/23/50 誘電正接(Df)@12GHz:平衡型円板
共振器法,C-24/23/50 		誘電正接(Df)@14GHz:平衡型円板
共振器法,C-24/23/50 		T288（銅無）:IPC-TM-650 2.4.24.1
(min)		 T288（銅付）:IPC-TM-650 2.4.24.1
(min)		 熱膨張係数: α1 タテ方向,IPC-TM-650 2.4.24
(ppm/°C)		 熱膨張係数:α1 ヨコ方向,IPC-TM-650 2.4.24
(ppm/°C)		 熱膨張係数:α1 厚さ方向,IPC-TM-650 2.4.24
(ppm/°C)		 熱膨張係数:α2 厚さ方向,IPC-TM-650 2.4.24
(ppm/°C)		 熱伝導率:レーザーフラッシュ法,25˚C
(W/m·K)		 体積抵抗率:IPC-TM-650 2.5.17.1,C-96/35/90
(MΩ·cm)		 表面抵抗:IPC-TM-650 2.5.17.1,C-96/35/90
(MΩ)		 吸水率:IPC-TM-650 2.6.2.1,D-24/23
(%)		 曲げ弾性率 タテ方向:JIS C 6481
(GPa)		 曲げ弾性率 ヨコ方向:JIS C 6481
(GPa)		 銅箔引き剥がし強さ 1oz:IPC-TM-650 2.4.8
(kN/m (lb/inch))		 銅箔引き剥がし強さ 1oz(H-VLP3):IPC-TM-650 2.4.8
(kN/m)		 耐燃性:UL法,C-48/23/50 サンプル厚さ 上記データは当社測定による代表値であり、保証値ではありません。 *1 試験方法:TMA
R-1577/R-1570
 MEGTRON2, MEGTRON2E
Halogen-free Low transmission loss Highly heat resistant Multi-layer circuit board materials 		170 165 190 380 4.1 - 4 - 0.01 0.013 - - >120 25 14-16 14-16 34 200 0.5 1 x 10⁹ 1 x 10⁸ 0.14 25 23 1.3(7.4) - 94V-0 0.8mm - -
R-1577E/R-1570E
 MEGTRON2, MEGTRON2E
Halogen-free Low transmission loss Highly heat resistant Multi-layer circuit board materials 		173 170 190 385 4.2 - 4.1 - 0.01 0.013 - - >120 25 14-16 14-16 35 210 0.5 - - - 25 23 1.3(7.4) - 94V-0 0.8mm - -
R-1755V
 HIPER V
Highly heat resistant Low CTE Multi-layer circuit board materials <High-Tg type>		 173 165 190 350 4.4 - 4.3 - 0.016 0.02 - - >120 20 11-13 13-15 44 255 0.53 1 x 10⁹ 1 x 10⁸ 0.12 24 22 1.5(8.6) - 94V-0 0.8mm - -
R-5375(E)/R-5370(E)
 Halogen-free MEGTRON6 series
Halogen-free Ultra-low transmission loss Multi-layer circuit board materials, 		- 210 250 435 3.7 - 3.7 - 0.002 - 0.002 - >120 >120 14-16 14-16 39 200 0.37 1 x 10⁹ 1 x 10⁸ 0.22 19 18 0.6(3.4)
(Cu:H-VLP2)		 - 94V-0
equivalent		 0.75mm - -
R-5375(N)/R-5370(N)
 Halogen-free MEGTRON6 series
Halogen-free Ultra-low transmission loss Multi-layer circuit board materials, 		- 210 250 435 3.4 - 3.4 - 0.001 - 0.001 - >120 >120 14-16 14-16 39 200 0.37 1 x 10⁹ 1 x 10⁸ 0.23 20 19 0.6(3.4)
(Cu:H-VLP2)		 - 94V-0
equivalent		 0.75mm - -
R-5725/R-5620
 MEGTRON4S, MEGTRON4
Low transmission loss Highly heat resistant Multi-layer circuit board materials 		176 170 210 360 3.8 - 3.8 - 0.005 0.007 - - >120 30 12-14 13-15 35 265 0.6 1 x 10⁹ 1 x 10⁸ 0.14 25 23 1.1(6.3)
(Cu:RT)		 - 94V-0 0.8mm - -
R-5725S/5620S
 MEGTRON4S, MEGTRON4
Low transmission loss Highly heat resistant Multi-layer circuit board materials 		200 190 215 360 3.8 - 3.8 - 0.005 0.007 - - >120 50 12-14 13-15 32 250 0.6 1 x 10⁹ 1 x 10⁸ 0.14 25 23 1.3(7.4)
(Cu:RT)		 - 94V-0 0.8mm - -
R-5735/R-5630
 MEGTRON M
Low transmission loss Highly heat resistant Multi-layer circuit board materials 		- - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
R-5775(G)/R-5670(G)
 MEGTRON6 series
Ultra-low transmission loss Highly heat resistant Multi-layer circuit board materials 		185 - 210 410 3.7 - 3.6 - 0.002 - 0.004 - >120 >120 14-16 14-16 45 260 0.42 1 x 10⁹ 1 x 10⁸ 0.14 20 19 0.8(4.6)
(Cu:H-VLP)		 - 94V-0 0.75mm - -
R-5775(K)/R-5670(K)
 MEGTRON6 series
Ultra-low transmission loss Highly heat resistant Multi-layer circuit board materials 		185 - 210 410 3.7 - 3.6 - 0.002 - 0.004 - >120 >120 14-16 14-16 45 260 0.42 1 x 10⁹ 1 x 10⁸ 0.14 20 19 0.8(4.6)
(Cu:H-VLP)		 - 94V-0 0.75mm - -
R-5775(N)/R-5670(N)
 MEGTRON6 series
Ultra-low transmission loss Highly heat resistant Multi-layer circuit board materials 		185 - 210 410 3.4 - 3.4 - 0.002 - 0.004 - >120 >120 14-16 14-16 45 260 0.42 1 x 10⁹ 1 x 10⁸ 0.14 19 18 0.8(4.6)
(Cu:H-VLP)		 - 94V-0 0.75mm - -
R-5775(R)
 MEGTRON6 series
Ultra-low transmission loss Highly heat resistant Multi-layer circuit board materials 		- - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
R-5775(S)
 MEGTRON6 series
Ultra-low transmission loss Highly heat resistant Multi-layer circuit board materials 		- - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
R-5785(GE)/R-5680(GE)
 MEGTRON7 series
Ultra-low transmission loss Highly heat resistant Multi-layer circuit board materials		 200 - 210 400 3.6 - 3.6 - 0.002 - 0.003 - >120 >120 14-16 14-16 42 280 0.4 1 x 10⁹ 1 x 10⁸ 0.06 20 19 0.8(4.6)
(Cu:H-VLP2)		 - 94V-0 0.75mm - -
R-5785(GN)/R-5680(GN)
 MEGTRON7 series
Ultra-low transmission loss Highly heat resistant Multi-layer circuit board materials		 200 190 210 400 3.4 - 3.4 - 0.001 - 0.002 - >120 >120 14-16 14-16 42 280 0.4 1 x 10⁹ 1 x 10⁸ 0.06 19 18 0.8(4.6)
(Cu:H-VLP2)		 - 94V-0 0.75mm - -
R-5785(GN)/R-5681(GN)
 MEGTRON7 series
Ultra-low transmission loss Highly heat resistant Multi-layer circuit board materials		 200 190 210 400 - - - - - - - - >120 >120 - - - - - - - - - - - - - - - -
R-5785(N)/R-5680(N)
 MEGTRON7 series
Ultra-low transmission loss Highly heat resistant Multi-layer circuit board materials		 200 - 210 400 3.4 - 3.4 - 0.001 - 0.002 - >120 >120 14-16 14-16 42 280 0.4 1 x 10⁹ 1 x 10⁸ 0.06 19 18 0.8(4.6)
(Cu:H-VLP)		 - 94V-0 0.75mm - -
R-5785(R)
 MEGTRON7 series
Ultra-low transmission loss Highly heat resistant Multi-layer circuit board materials		 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
R-5795(N)
 MEGTRON8 series
Ultra low transmission loss, highly heat-resistant multi layer circuit board materials 		- - 220 370 - - - 3.13 - - - 0.0016 - >60 17-20 17-20 50 270 - - - 0.06 - - - 0.7 94V-0 0.75mm - -
R-5795(U)
 MEGTRON8 series
Ultra low transmission loss, highly heat-resistant multi layer circuit board materials 		- - 220 370 - - - 3.08 - - - 0.0012 - >60 17-20 17-20 50 270 - - - 0.06 - - - 0.7 94V-0 0.75mm - -
R-579Y(U)
 - MEGTRON8 series
Ultra low transmission loss, highly heat-resistant multi layer circuit board materials 		- - 220 370 - - - 3.08 - - - 0.0012 - >60 17-20 17-20 50 270 - - - 0.06 - - - 0.7 94V-0 0.75mm - -
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