Reduces the load of customers' circuit formation. Contribute to the impedance matching and crosstalk prevention by increasing flexibility of board design.
Possible to be high multi-layered up to 24 layers.
Quick delivery from order to shipment.
Circuit Board Materials
- Part Number
![PreMulti](/content/data/EM/pictures/logo_premulti.gif)
- Application
- Detailed use
![Automotive](/content/data/EM/pictures/pict_cbm_aut.gif)
![Mobile](/content/data/EM/pictures/pict_cbm_mob.gif)
・Automotive
・Mobile
・Mobile
Automotive component, Mobile product(PC and related equipment, Mobile phone, Laptop etc.), Amusement machine, Digital appliance, Measuring instrument, Semiconductor test equipment, Semiconductor memory board, etc.
Properties
High multi-layered
~24 layers
~24 layers
AOI inspection for
all materials
all materials
Quick delivery
What's Mass laminations?
![What's Mass laminations?](/content/data/EM/pictures/ww_img_premulti_01.jpg)
Line-up
Product Number | Comment |
C-1810 | Glass epoxy resin shield board used R-1766 material |
C-1510 | Halogen-free shield board used R-1566 material |
C-1850D | High heat resistance shield board for Automotive component used R-1755D material |
C-1850S | High heat resistance shield board for ICT infrastructure equipment used R-1755S material |
Specification list
Item | General Specifications |
Board thickness(Max) | 2.40mm±10% |
Board thickness(Min) | 0.24mm±10% |
Dimensional tolerance between the reference mark | ±0.15mm |
Accuracy of the layer reach | 0.15mm or less |
Warpage | 1% or less of the long side |
Line/Space | Copper thickness 12μm: 50/50μm Copper thickness 18μm: 50/50μm Copper thickness 35μm: 75/75μm Copper thickness 70μm: 100/100μm Copper thickness 105μm: 150/150μm |
※The above data is general specifications. Please contact us for more specifications.
The above data are typical values and not guaranteed values.