Multi-layer circuit board materials | R-1766

Multi-layer circuit board materials R-1766

 

  1. Good secondary lamination molding processability, excellent adhesion between the layers, compatible with high-speed drilling processability
  2. Excellent dimensional stability, Flammability UL94V-0
  3. Line-up of clearpregs with reduced occurrence of resin powder

Product features

Multi-layer circuit board materials R-1766

  • Laminate R-1766 Prepreg R-1661

For automotive components, etc

Automotive components, Amusement, Digital appliance, Mobile product, Measuring instruments, Small and medium-sized computer, Semiconductor test equipment

Specifications

Specifications

Note: For thickness tolerance of the thickness located midway in the table, whichever is thicker shall be applied.
Note: For detail dimensions, please contact us separately.

General properties

Item Test method Condition Unit R-1766
Glass transition temp (Tg) DSC A °C 140
Thermal decomposition (Td) TG/DTA A °C 315
CTE x-axis α1 IPC TM-650 2.4.41 A ppm/°C 11-13
CTE y-axis 13-15
CTE z-axis α1 IPC TM-650 2.4.24 A 65
α2 270
T288 (with copper) IPC TM-650 2.4.24.1 A min 1
Dielectric constant (Dk) 1GHz IPC TM-650 2.5.5.9 C-24/23/50 4.3
Dissipation factor (Df) 0.016
Water absorption IPC TM-650 2.6.2.1 D-24/23 % 0.14
Flexural modulus Fill JIS C6481 A GPa 21
Peel strength 1oz IPC TM-650 2.4.8 A kN/m 2.0

The sample thickness is 0.8mm.

The above data are typical values and not guaranteed values.