加入内层电路的多层基板材料「PreMulti」

Reduces the load of customers' circuit formation. Contribute to the impedance matching and crosstalk prevention by increasing flexibility of board design.
Possible to be high multi-layered up to 24 layers.
Quick delivery from order to shipment.

Circuit Board Materials

Part Number

Application
Detailed use

・Automotive
・Mobile

Automotive component, Mobile product(PC and related equipment, Mobile phone, Laptop etc.), Amusement machine, Digital appliance, Measuring instrument, Semiconductor test equipment, Semiconductor memory board, etc.

Properties

High multi-layered
~24 layers

AOI inspection for
all materials

Quick delivery

What's Mass laminations?

Line-up

Product Number	Comment
C-1810	Glass epoxy resin shield board used R-1766 material
C-1510	Halogen-free shield board used R-1566 material
C-1850D	High heat resistance shield board for Automotive component used R-1755D material
C-1850E	Shield board for Automotive component used R-1755E material
C-1850S	High heat resistance shield board for ICT infrastructure equipment used R-1755S material

Specification list

Item	General Specifications
Board thickness(Max)	2.40mm±10%
Board thickness(Min)	0.24mm±10%
Dimensional tolerance between the reference mark	±0.15mm
Accuracy of the layer reach	0.15mm or less
Warpage	1% or less of the long side
Line/Space	Copper thickness 12μm: 50/50μm Copper thickness 18μm: 50/50μm Copper thickness 35μm: 75/75μm Copper thickness 70μm: 100/100μm Copper thickness 105μm: 150/150μm