Electronic Materials
Product Number | Comment |
C-1810 | Glass epoxy resin shield board used R-1766 material |
C-1510 | Halogen-free shield board used R-1566 material |
C-1850D | High heat resistance shield board for Automotive component used R-1755D material |
C-1850E | Shield board for Automotive component used R-1755E material |
C-1850S | High heat resistance shield board for ICT infrastructure equipment used R-1755S material |
Item | General Specifications |
Board thickness(Max) | 2.40mm±10% |
Board thickness(Min) | 0.24mm±10% |
Dimensional tolerance between the reference mark | ±0.15mm |
Accuracy of the layer reach | 0.15mm or less |
Warpage | 1% or less of the long side |
Line/Space | Copper thickness 12μm: 50/50μm Copper thickness 18μm: 50/50μm Copper thickness 35μm: 75/75μm Copper thickness 70μm: 100/100μm Copper thickness 105μm: 150/150μm |
※The above data is general specifications. Please contact us for more specifications.
The above data are typical values and not guaranteed values.