For Intelligent Power Module (IPM) High heat resistance semiconductor encapsulation materials | X8540

For Intelligent Power Module (IPM) High heat resistance semiconductor encapsulation materials

 

  1. Excellent heat resistance and can correspond to the next generation power device (GaN, SiC).
  2. Contribute to improvement of performance and reliability of power module under high temperature environment.

Semiconductor Encapsulation Materials/Adhesive

  •  Part Number 

X8540 series

  • Application
  • Detailed use
Package
・Package
Power Devices used in Industry/Automotive Inverters

Properties

Low warpage, Low stress
High heat resistance
High volume resistivity

Concept/Line-up

Concept/Line-up

Evaluation of volume resistance (Tg dependence)

Evaluation of volume resistance (Tg dependence)

Dielectric property (Tg dependence)

Dielectric property (Tg dependence)

General properties

Item Unit X8540-SPL1 X8540-SPL2
Target Package For Module,TO247,etc. (with Cu L/F) For Module (with Ceramic substrate)
Feature Middle CTE & Low modulus Low CTE & Low modulus
C.T.E. (α1/α2) ppm/℃ 10/46 8/36
Tg (TMA) 210 210
Flexural modulus (RT/260℃) GPa 13/1.0 13/1.0
Flexural strength (RT/260℃) MPa 110/23 100/21
Cure condition 175℃/100-150sec
Post mold cure 175-200℃/4-8hr (200℃/4hr for above properties)
Nickel plating adhesion* 10 10

*Internal evaluation method: Shear adhesive strength to Ni plating

The above data is actual values and not guaranteed values.

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