放大
本材料是为了针对客户多样的散热用途，提供适用的解决方案中所用的基板材料。
实现树脂基板才拥有的易加工和易设计性，以及优异的性价比。
本产品阵容中包括单面/双面板型、挠性型、多层型和薄板型的产品。
Circuit Board Materials
Circuit board material thermal characteristics
General properties
| Item | Unit | ECOOL R-1787 |
Our conventional FR-4 R-1705 |
|---|---|---|---|
| UL/ANSI grade | ― | CEM-3 | FR-4.0 |
| Dielectric layer thickness | mm | 1.0 | 1.0 |
| Thermal conductivity*1 | W/m･K | 1.1 | 0.4 |
| Thermal resistance | ℃/W | 6.7 | 17.5 |
Condition : As received
*1 Laser flash method
The above data are typical values and not guaranteed values.
