Highly heat-resistant halogen-free multi-layer circuit board materials | R-356AD, R-356YD

Supports high heat resistance and high withstand voltage required for xEV and Industrial devices
Support in reduction of PCB board size due to reduced creepage distances by excellent tracking resistance
Halogen-free material reducing environmental impact

Circuit Board Materials

Part Number

Application
Detailed use

・Automotive
・Industry

On Board Charger, DC/DC Converter, Inverter, In-Wheel Motor
EV Charging Stand, HV Control Unit, PV Module

New part number *

Laminate R-356AD

Prepreg R-355AD

Laminate R-356YD

Prepreg R-355YD

* UL certification products

Properties

CTI≧600V
(R-356AD*¹, R-356YD)

RTI 150°C
(R-356AD*², R-356YD*³)

High voltage CAF resistance
(1000V)

The sample thickness *1: 0.8mm or less, *2: 0.8mm, *3: 0.63mm or more

Positioning of R-356AD, R-356YD

Through-hole reliability

Insulation reliability

General properties

Item		Test method	Condition	Unit	Halogen-free R-356AD	Halogen-free R-356YD	Our conventional Halogen-free R-1566(W)
Glass transition temp. (Tg)		DSC	A	°C	175		148
		TMA			170		145
Thermal decomposition temp. (Td)		TGA	A	°C	355		350
T288 (with copper)		IPC-TM-650 2.4.24.1	A	min	10		3
CTE z-axis	α1	IPC-TM-650 2.4.24	A	ppm/°C	40		40
	α2				180		180
RTI		UL Method	C-48/23/50	°C	150*¹	150*²	130
PLC				–	0*³	0	1
Peel strength	1oz (35µm)	IPC-TM-650 2.4.8	A	kN/m	1.6	1.6	1.8
Flammability		UL Method	C-48/23/50	–	94V-0*³	94V-1	94V-0

The sample thickness is 0.8mm.
*1 Thickness is 0.8mm *2 Thickness is 0.63mm or more *3 Thickness is 0.8mm or less

Our Halogen-free materials are based on JPCA-ES-01-2003 standard and others.
Contain; Chlorine:≤0.09wt%(900ppm), Bromine:≤0.09wt%(900ppm),
Chlorine+Bromine:≤0.15wt%(1500ppm)

The above data are typical values and not guaranteed values.

For your study !

To extend the cruising range of a BEV or to improve the power output of an Industrial Device, SiC and GaN semiconducters are used for related electronic components like DC/DC converter or Inverter. Those devices are able to work at higher voltages and also higher temperatures. On the other hand, the reductions of size and weight are common topics on every automotive part.

The CTI (comparative tracking index) and the RTI (Reference Temperature Index) are important base material characteristics to support such market trends.

Relationship between creepage distance and CTI

CTI is used to assess the relative resistance of insulating materials to tracking. It is one of the factors that influences the layout of the creepage distance on a PCB (Fig.1).

It is possible to reduce the creepage distance on a board, at the same voltage, if a material with a higher CTI is used. (Fig.2)

Fig.2 General relationship between Comparative Tracking Index (CTI) and creepage distance

Relationship between RTI* and MOT

In former Times FR-4 has been dedicated to a max. RTI (Reference Temperature Index) of a maximum of 130°C. Higher temperature requirements on PCB application and its components (like GaN and SiC).

Materials inside this class are showing a max. RTI of 150°C.
If the final equipment has to fulfil a MOT (Maximum Operation Temperature) of 150°C, you must use Highly heat resistant materials with a minimum RTI of 150°C.

* RTI (Relative Thermal Index)
An indicator of the ability of a material to retain certain physical properties (physical, electrical, etc.) when exposed to high temperatures for extended periods of time.

The material has excellent tracking and heat resistance. This material is suitable for various applications that require high voltage and downsizing, such as automotive and industrial applications.