- Good impedance matching at ultra-thin insulated layer with low Dk property.
- Contribute to thinner and compact of mobile product.
Circuit Board Materials
- Part Number
- Application
- Detailed use
・Mobile
・Automotive
・Automotive
Smartphone, Tablet PC, In-vehicle autonomous driving server,etc.
New part number *
Laminate R-A555W
Prepreg R-A550W
Laminate R-A555Y
Prepreg R-A550Y
* UL certification products
Properties
Dk 3.4 ＠2GHz
(Resin content 70wt%)
(Resin content 70wt%)
CTE z-axis
41ppm/°C
41ppm/°C
Tg (DMA)
200°C
200°C
Impedance simulation (Strip Line)
Halogen-free material mapping
General properties
| Item | Test method | Condition | Unit | Halogen-free R-A555W R-A555Y | Conventional Halogen-free R-1566(W) | |
| Glass transition temp. (Tg) | DMA | A | °C | 200 | 170 | |
| CTE z-axis | α1 | IPC-TM-650 2.4.24 | A | ppm/°C | 41 | 52 |
| α2 | 270 | 300 | ||||
| T288 (with copper) | IPC-TM-650 2.4.24.1 | A | min | >60 | 3 | |
| Dielectric constant (Dk)*¹ | 2GHz | IPC-TM-650 2.5.5.5 | C-24/23/50 | – | 3.4 | – |
| Dissipation factor (Df)*¹ | 0.010 | – | ||||
The sample thickness is 0.8mm.
*1 Resin content:70wt%
Our Halogen-free materials are based on JPCA-ES-01-2003 standard and others.
Contain; Chlorine:≤0.09wt%(900ppm), Bromine:≤0.09wt%(900ppm),
Chlorine+Bromine:≤0.15wt%(1500ppm)
The above data are typical values and not guaranteed values.
