系列/类型
Glass transition temp.(Tg) :DSC
Glass transition temp.(Tg) :TMA
Glass transition temp.(Tg) :DMA
Thermal decomposition temp.(Td):TGA
Thermal decomposition temp.(Td):TG/DTA
Time to delam(T288)Without Cu:IPC-TM-650 2.4.24.1
Time to delam(T288)With Cu:IPC-TM-650 2.4.24.1
CTE:α1,X-axis,IPC-TM-650 2.4.24
CTE:α1,X-axis,IPC-TM-650 2.4.41
CTE:α1,Y-axis,IPC-TM-650 2.4.24
CTE:α1,Y-axis,IPC-TM-650 2.4.41
CTE:α1,Z-axis,IPC-TM-650 2.4.24
CTE:α2,Z-axis,IPC-TM-650 2.4.24
Volume resistivity:IPC-TM-650 2.5.17.1,C-96/35/90
Surface resistivity:IPC-TM-650 2.5.17.1,C-96/35/90
Dielectric constant(Dk)@1MHz:IPC-TM-650 2.5.5.9,C-24/23/50
Dielectric constant(Dk)@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50
Dissipation factor(Df )@1MHz:IPC-TM-650 2.5.5.9,C-24/23/50
Dissipation factor(Df )@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50
Water absorption:IPC-TM-650 2.6.2.1,D-24/23
Peel strength,1oz:IPC-TM-650 2.4.8
Flammability:UL,C-48/23/50
Volume resistivity:C-96/20/65
Volume resistivity:C-96/20/65+C-96/40/90
Surface resistivity:C-96/20/65
Surface resistivity:C-96/20/65+C-96/40/90
Insulation resistance:C-96/20/65
Insulation resistance:C-96/20/65+D-2/100
Dielectric constant (Dk)1MHz:JIS C-96/20/65
Dielectric constant (Dk)1MHz:C-96/20/65+D-24/23
Dissipation factor (Df)1MHz:C-96/20/65
Dissipation factor (Df)1MHz:C-96/20/65+D-24/23
Solder heat resistance (260°C)
Peel strength,Copper foil:0.018mm
(18μm),A
Peel strength,Copper foil:0.018mm
(18μm),S₄
Peel strength,Copper foil:0.035mm
(35μm),A
Peel strength,Copper foil:0.035mm
(35μm),S₄
Heat resistance
Flexural strength:Fill
Water absorption:E-24/50+D-24/23
Flammability:
Alkali resistance:dipping (3min)
The sample thickness
The above data are typical values and not guaranteed values.