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R-1785 : 玻璃复合基板材料

产品名
玻璃复合基板材料

系列/类型
High reliability Glass composite Circuit board materials

型号
R-1785

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一张照片：R-1785
项目 内容
Glass transition temp.(Tg) :TMA,Temp. rising rate: 10°C/min (°C) 150
Solder heat resistance:JIS C6481,260°C solder float for 2min No abnormality
Heat resistance,1oz:JIS C6481 -
CTE:α1,X-axis,IPC-TM-650 2.4.41,TMA (ppm/°C) 19 (15)
CTE:α1,Y-axis,IPC-TM-650 2.4.41,TMA (ppm/°C) 21 (17)
CTE:α1,Z-axis,IPC-TM-650 2.4.24,TMA (ppm/°C) 50
Dielectric constant
(Dk):1MHz,IPC-TM-650 2.2.2.9,C-24/23/50		 4.2
Dielectric constant
(Dk):1GHz,IPC-TM-650 2.2.2.9,C-24/23/50		 4
Dielectric constant
(Dk):1MHz,JIS C6481,C-96/20/65		 -
Dielectric constant
(Dk):1MHz,JIS C6481,C-96/20/65+D-24/23		 -
Dielectric constant (Dk):1GHz,IPC TM-650 2.5.5.9,C-24/23/50 -
Dissipation factor (Df):1MHz,IPC TM-650 2.5.5.9,C-24/23/50 0.023
Dissipation factor (Df):1GHz,IPC TM-650 2.5.5.9,C-24/23/50 0.01
Dissipation factor(Df):1MHz,JIS C6481,C-96/20/65 -
Dissipation factor (Df):1MHz,JIS C6481,C-96/20/65+D-24/23 -
Dissipation factor (Df):1GHz,IPC TM-650 2.5.5.9,C-24/23/50 -
Volume resistivity:JIS C6481,C-96/20/65 (MΩ·m) -
Volume resistivity:JIS C6481,C-96/20/65+C-96/40/90 (MΩ·m) -
Surface resistivity:JIS C6481,C-96/20/65 (MΩ) -
Surface resistivity:JIS C6481,C-96/20/65+C-96/40/90 (MΩ) -
Insulation resistance:JIS C6481,C-96/20/65 (MΩ) 5x10^8
Insulation resistance:JIS C6481,C-96/20/65+D-2/100 (MΩ) -
Water absorption:JIS C6481,E-24/50+D-24/23 (%) -
Flexural strength:Fill,JIS C6481 (N/mm²) -
Peel strength:JIS C6481,Copper foil0.018mm(18µm),A (N/mm) -
Peel strength:JIS C6481,Copper foil0.018mm(18µm),S₄ (N/mm) -
Peel strength:JIS C6481,Copper foil0.035mm(35µm),A (N/mm) -
Peel strength:JIS C6481,Copper foil0.035mm(35µm),S₄ (N/mm) -
Peel strength:2oz,JIS C6481,A (kN/m) -
Peel strength:2oz,JIS C6481,260°C solder float for 20sec (kN/m) -
Alkali resistance:JIS C6481,dipping (3min) -
Flammability:JIS C6481,A+E-168/70 -
Tracking resistance:IEC 60112 (V) CTI≧600
Accuracy of thickness (σ value) (mm) 0.013
[目录/资料]
Catalog_R-1785_en(84KB)