Ultra-low transmission loss Highly heat resistant Multi-layer circuit board materials MEGTRON6 | R-5775(N), R-5775

Ultra-low transmission loss Highly heat resistant Multi-layer circuit board materials MEGTRON6 R-5775(N) R-5775

 

  1. The industry standard for high speed, ultra-low loss material.
  2. Excellent HDI and thermal performance.

Circuit Board Materials

  • Part Number

Low Dk glass cloth

Laminate R-5775(N)
Prepreg R-5670(N)

Normal glass cloth

Laminate R-5775
Prepreg R-5670

  • Application
  • Detailed use
Network
Wireless
・Network
・Wireless
ICT infrastructure equipment, Supercomputer, Measuring instrument, Antenna(Base station, Automotive millimeter-wave radar), Etc.

Properties

Dk 3.4 Df 0.004
@12GHz
Tg(DSC)
185°C
T288(with copper)
>120min

Transmission loss performance Ranking in MEGTRON series

Transmission loss performance Ranking in MEGTRON series

Frequency dependence by Transmission loss

Frequency dependence by Transmission loss

Heat resistance of High Multi-layer

Heat resistance of High Multi-layer

Dielectric property

Dielectric property

General properties

Item Test method Condition Unit MEGTRON6
R-5775(N)
Low Dk glass cloth
MEGTRON6
R-5775
Normal glass cloth
Glass transition temp.(Tg) DSC A °C 185 185
Thermal decomposition temp.(Td) TGA A °C 410 410
CTE x-axis α1 IPC-TM-650 2.4.24 A ppm/°C 14-16 14-16
CTE y-axis 14-16 14-16
CTE z-axis α1 IPC-TM-650 2.4.24 A 45 45
α2 260 260
T288(with copper) IPC-TM-650 2.4.24.1 A min >120 >120
Dielectric constant(Dk) 12GHz Balanced-type
circular disk resonator
C-24/23/50 3.4 3.6
Dissipation factor(Df) 0.004 0.004
Water absorption IPC-TM-650 2.6.2.1 D-24/23 % 0.14 0.14
Flexural modulus Fill JIS C 6481 A GPa 18 19
Peel strength* 1oz(35μm) IPC-TM-650 2.4.8 A kN/m 0.8 0.8

The sample thickness is 0.75mm.
*H-VLP Copper

The above data are typical values and not guaranteed values.