- Achieve more functionality (multi-pin and integrated circuit) the large-sized PKG by excellent modulus and high heat resistance property
Circuit Board Materials
- Part Number
Laminate R-1515W
Prepreg R-1410W
- Application
IC substrate
Properties
Flexural modulus
25°C 35GPa
25°C 35GPa
CTE x, y-axis
9ppm/°C
9ppm/°C
Tg (DMA)
250°C
250°C
Pakage warpage
Thermal expansion (x-axis)
Heat resistance
General properties
| Item | Test method | Condition | Unit | LEXCM GX R-1515W | |
| Glass transition temp (Tg) | DMA*² | A | °C | 250 | |
| Thermal decomposition temp (Td) | TGA | A | °C | 390 | |
| CTE x-axis | α1 | Internal method | A | ppm/°C | 9 |
| CTE y-axis | 9 | ||||
| CTE z-axis | α1 | IPC-TM-650 2.4.24 | A | 22 | |
| α2 | 97 | ||||
| Flexural modulus*¹ | JIS C 6481 | 25°C | GPa | 35 | |
| 250°C | 21 | ||||
The sample thickness is 0.1mm.
*1 0.8mm
*2 Measurement in bending mode
Our Halogen-free materials are based on JPCA-ES-01-2003 standard and others.
Contain; Chlorine:≤0.09wt%(900ppm), Bromine:≤0.09wt%(900ppm),
Chlorine+Bromine:≤0.15wt%(1500ppm)
The above data are typical values and not guaranteed values.
