- Suitable for high-speed large-volume data transmission by servers and routers at high-end and volume designs.
Circuit Board Materials
- Part Number
Laminate R-5735
Prepreg R-5630
- Application
- Detailed use
・Network
・Wireless
・Wireless
ICT infrastructure equipment, Supercomputer, Measuring instrument, Antenna, Etc.
Properties
Dk 3.75 Df 0.0087
@13GHz
@13GHz
Tg(DSC)
195°C
195°C
T288(with copper)
35min
35min
Video
Transmission loss performance Ranking in MEGTRON series
Frequency dependence by Transmission loss
Heat resistance of High Multi-layered
Solder heat resistance(float)
IST(Interconnect Stress Test)
General properties
| Item | Test method | Condition | Unit | MEGTRON M R-5735 |
|
|---|---|---|---|---|---|
| Glass transition temp.(Tg) | DSC | A | °C | 195 | |
| CTE z-axis | α1 | IPC-TM-650 2.4.24 | A | ppm/°C | 31 |
| α2 | 240 | ||||
| T288(with copper) | IPC-TM-650 2.4.24.1 | A | min | 35 | |
| Dielectric constant(Dk) | 13GHz | Balanced-type circular disk resonator method |
C-24/23/50 | － | 3.75 |
| Dissipation factor(Df) | 0.0087 | ||||
| Peel strength | 1oz(35μm) | IPC-TM-650 2.4.8 | A | kN/m | 1.3 [ST] |
The sample thickness is 0.8mm.
The above data are typical values and not guaranteed values.
Related information
[ Product summary ]
[ Data Sheet ]
- * Revised due to changes in high-frequency measuring equipment
** Former version, Before April 2022
