High reliability Glass composite Circuit board materials | R-1785

High reliability Glass composite Circuit board materials R-1785


  1. Improved solder joint reliability compared with conventional CEM-3 which has already good to safety and long-time reliability property.
    Contribute to high reliability PCB for electric car.

Circuit Board Materials

  • Part Number

Double-sided R-1785

  • Application
  • Detailed use
Automotive component, Power supply board, Power device module board, Infrastructure(Smart meter, IC tag), etc.


CTE x,y-axis
Tg (TMA)

Solder joint reliability

Solder joint reliability

CAF resistance

CAF resistance

General properties

Item Test method Condition Unit R-1785 Our conventional
Our conventional
Glass transition temp. (Tg) TMA Temp. rising rate: 10°C/min °C 150 140 140
Solder heat resistance JIS C 6481 A
260°C solder float for 2min
No abnormality No abnormality No abnormality
CTE x-axis α1 IPC-TM-650 2.4.41 TMA ppm/°C 19 (15) 25 (20) 13
CTE y-axis   21 (17) 28 (23) 15
CTE z-axis α1 IPC-TM-650 2.4.24 TMA ppm/°C 50 65 65
Dielectric constant (Dk) 1MHz IPC-TM-650 C-24/23/50 4.2 4.2* (4.6)
1GHz 4.0 4.0 (4.3)
Dissipation factor (Df) 1MHz 0.023 0.011* (0.014)
1GHz 0.010 0.007 (0.016)
Insulation resistance JIS C 6481 C-96/20/65 5×10 5×10 1×10
Tracking resistance IEC 60112 A V CTI≥600 CTI≥600 250>CTI≥175
Accuracy of thickness (σ value) A mm 0.013 0.013 0.027

The sample thickness is 1.6mm.
The figure in parentheses is for the thickness of 0.8mm.
* Test method and condition are in accordance with JIS C6481, C-96/20/65.

The above data are typical values and not guaranteed values.