High heat resistance (Middle-Tg) multi-layer circuit board materials HIPER M | R-1755M

High heat resistance (Middle-Tg) multi-layer circuit board materials HIPER M

 

  1. High heat resistance Middle Tg: 153°C (DSC), Td: 355°C
  2. Low CTE: 40ppm/°C (z-axis) (About 25ppm lower than our conventional FR-4 R-1766)
  3. Excellent CAF resistance & laminate processability

Product features

High heat resistance (Middle-Tg) multi-layer circuit board materials HIPER M

HIPER M
  • Laminate R-1755M Prepreg R-1650M

For automotive components

Automotive components(Engine room ECU), Electronic devices that require high reliability(use of lead-free solder), etc.

Through-hole reliability

Through-hole reliability

CAF resistance

CAF resistance

General properties

Item Test method Condition Unit HIPER M
R-1755M
Conventional
FR-4
R-1766
Glass transition temp (Tg) DSC A °C 153 140
Thermal decomposition temp (Td) TG/DTA A °C 355 315
CTE x-axis α1 IPC TM-650 2.4.41 A ppm/°C 11-13 11-13
CTE y-axis 13-15 13-15
CTE z-axis α1 IPC TM-650 2.4.24 A 40 65
α2 240 270
T288 (with copper) IPC TM-650 2.4.24.1 A min 18 1
Dielectric constant (Dk) 1GHz IPC TM-650 2.5.5.9 C-24/23/50 4.6 4.3
Dissipation factor (Df) 0.014 0.016
Water absorption IPC TM-650 2.6.2.1 D-24/23 % 0.11 0.14
Flexural modulus Warp JIS C6481 A GPa 24 23
Fill 22 21
Peel strength 1oz IPC TM-650 2.4.8 A kN/m 1.5 2.0
Flammability UL 94V-0 94V-0

The sample thickness is 0.8mm.

The above data are typical values and not guaranteed values.