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车载设备用 多层基板材料「HIPER」系列

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本材料是具有优异的高可靠性和高耐热性的多层基板材料。
其在严峻的使用环境下也具有优异耐CAF性和可靠的通孔导通性，还具有良好的基板加工性。

Circuit Board Materials

Electronic Materials

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General properties

Item Test method Condition Unit HIPER V
R-1755V		 HIPER D
R-1755D		 HIPER M
R-1755M		 HIPER E
R-1755E		 Halogen
-free
R-1566		 Conventional
FR-4
R-1766
Glass transition temp (Tg) DSC A °C 173 163 153 133 148 140
Thermal decomposition temp (Td) TG/DTA A °C 350 345 355 370 350 315
CTE x-axis α1 IPC TM-650 2.4.41 A ppm/°C 11-13 10-12 11-13 11-13 11-13 11-13
CTE y-axis 13-15 12-14 13-15 13-15 13-15 13-15
CTE z-axis α1 IPC TM-650 2.4.24 A 44 43 40 42 40 65
α2 255 236 240 250 180 270
T288 (with copper) IPC TM-650 2.4.24.1 A min 20 15 18 25 3 1
Dielectric constant (Dk) 1GHz IPC TM-650 2.5.5.9 C-24/23/50 – 4.4 4.4 4.6 4.6 4.6 4.3
Dissipation factor (Df) 0.016 0.016 0.014 0.013 0.010 0.016
Water absorption IPC TM-650 2.6.2.1 D-24/23 % 0.12 0.11 0.11 0.11 0.14 0.14
Flexural modulus Fill JIS C6481 A GPa 22 21 22 22 22 21
Peel strength 1oz IPC TM-650 2.4.8 A kN/m 1.5 1.3 1.5 1.6 1.8 2.0

The sample thickness is 0.8mm.

The above data are typical values and not guaranteed values.