High heat resistance (High-Tg) multi-layer circuit board materials HIPER D | R-1755D

High heat resistance (High-Tg) multi-layer circuit board materials HIPER D

 

  1. High heat resistance Tg: 163°C (DSC)
  2. In harsh usage environments, excellent CAF resistance, mounting reliability and through-hole reliability
  3. Compatible with lead-free soldering, excellent laminate processability

Product features

High heat resistance (High-Tg) multi-layer circuit board materials HIPER D

HIPER D
  • Laminate R-1755D Prepreg R-1650D

For automotive components

Engine room ECU(direct mounting to the engine)

Through-hole reliability

Through-hole reliability

CAF resistance

CAF resistance

Reliability for solder connection of surface mounting parts

Reliability for solder connection of surface mounting parts

General properties

Item Test method Condition Unit HIPER D
R-1755D
Conventional
FR-4
R-1766
Glass transition temp (Tg) DSC A °C 163 140
Thermal decomposition temp (Td) TG/DTA A °C 345 315
CTE x-axis α1 IPC TM-650 2.4.41 A ppm/°C 10-12 11-13
CTE y-axis 12-14 13-15
CTE z-axis α1 IPC TM-650 2.4.24 A 43 65
α2 236 270
T288 (with copper) IPC TM-650 2.4.24.1 A min 15 1
Dielectric constant (Dk) 1GHz IPC TM-650 2.5.5.9 C-24/23/50 4.4 4.3
Dissipation factor (Df) 0.016 0.016
Water absorption IPC TM-650 2.6.2.1 D-24/23 % 0.11 0.14
Flexural modulus Warp JIS C6481 A GPa 23 23
Fill 21 21
Peel strength 1oz IPC TM-650 2.4.8 A kN/m 1.3 2.0
Flammability UL 94V-0 94V-0

The sample thickness is 0.8mm.

The above data are typical values and not guaranteed values.